Fluid processing apparatus and processing method

ABSTRACT

A fluid is processed between processing surfaces capable of approaching to and separating from each other, at least one of which rotates relative to the other. A first fluid containing a material to be processed is introduced between processing surfaces  1  and  2 , by using a micropump effect acting with a depression  13  arranged on the processing surfaces from the center of the rotating processing surfaces. A second fluid containing a material to be processed, independent of this introduced fluid, is introduced from another fluid path d 2  that is provided with an opening d 20  leading to the processing surfaces, whereby the processing is done by mixing and stirring between the processing members  1  and  2 . In a plane along the processing surfaces, directionality accompanies the introducing direction from the opening of the second fluid into the processing surfaces. Regarding the introducing direction of the second fluid, it is an outward direction away from the center for the fluid in the radial direction on the processing surface, and it is a forward direction for the fluid in the rotation direction of the fluid between the rotating processing surfaces.

TECHNICAL FIELD

The present invention relates to a fluid processing apparatus wherein amaterial to be processed is processed between processing surfaces inprocessing members capable of approaching to and separating from eachother, at least one of which rotates relative to the other.

BACKGROUND ART

Patent Document 1: JP-A 2006-104448

Patent Document 2: JP-A 2003-159696

Patent Document 3: JP-A 2003-210957

Patent Document 4: JP-A 2004-49957

Non-Patent Document 1: “Microreactor: Synthesis Technology in New Age”,supervised by Junichi Yoshida, CMC Publishing Co., Ltd.

Non-Patent Document 2: X. F. Zhang, M. Enomura, M. Tsutahara, K.Takebatashi, M. Abe “Surface Coatings International Prat B: CoatingsTransactions,” Vol. 89, B4, 269-274, December 2006

A microreactor or a micromixer has been provided as a fluid processingapparatus using a fine flow path or a fine reaction container. There ispossibility that the microscopic reaction field given by such anapparatus could exert a substantial influence on chemical reactionscarried out in beakers and flasks so far (see Non-Patent Document 1).

A typical micromixer and microreactor are provided with a plurality ofmicrochannels of about several ten μm to several hundred μm in diameterand with mixing spaces connected with the microchannels, and in thismicromixer and microreactor, a plurality of solutions are introducedinto the mixing spaces through a plurality of flow paths calledmicrochannels, thereby mixing the plurality of solutions or allowing achemical reaction together with mixing. For example, Patent Documents 1to 3 disclose those structures as microreactors and micromixers. In anyof these microreactors and micromixers, at least two types of solutionsare passed through fine microchannels respectively and fed as laminarflows having a very thin section, into a mixing space, and in thismixing space, two solutions are mixed and/or reacted.

There are many advantages in microreactors and systems thereof, but asthe micro flow path diameter is decreased, a pressure loss is inverselyproportional to the biquadrate of the flow path. That is, such highfeeding pressure is necessary that a pump making possible to feed afluid cannot be available. In the case of a reaction accompanied byseparation, there is a problem that a microwave flow path is blocked byclogging of a flow path with a product or bubbles the reactiongenerates. Further, it is also a problem that since the reactionfundamentally depends on speed of molecular diffusion, a microscopicspace is not effective or applicable to every reaction, and actualattempts of the reaction are required by trial and error, then goodresults are selected. Scaling up has been coped with a method ofincreasing the number of microreactors, that is a numbering-up system,but the number of microreactors which can be comprised is limited toseveral dozen, thus inherently aiming exclusively at products of highvalue. The increase in the number of devices leads to an increase in theabsolute number of failure causes, and when the problem of clogging orthe like actually occurs, it can be very difficult to detect a problemsite such as a failure site.

As shown in an apparatus in Patent Document 4 filed by the presentapplicant, there is an apparatus wherein a fluid containing a materialto be processed is introduced between the processing surfaces, at leastone of which rotates relative to the other, and which are capable ofapproaching to and separating from each other, and at least anotherfluid containing a material to be processed is introduced between theprocessing surfaces from another flow path that is independent of theflow path for introducing the first fluid and is provided with anopening leading to the processing surfaces, whereby the two fluids arereacted by mixing and stirring between the processing surfaces. By usingthis apparatus, improvement on speed of temperature homogenization,improvement on speed of homogenization of concentration, and reductionin processing time in support of molecular diffusion, which have beenattempted by conventional micro reactors, can be achieved moreeffectively than ever.

However, even if the apparatus with the mechanism described above isused to process between the processing surfaces, substances to beseparated would cause clogging in the vicinity of the opening in theprocessing surfaces by a reaction accompanied by separation at highreaction speed, and thus the reaction may be interrupted. Further, aspiral laminar flow that is a fluid formed between the processingsurfaces is disrupted thus often failing to attain intended favorableresults such as homogeneous processing and formation of microparticles.

In the case of processing with the apparatus shown above, the processingsurfaces provided with a depression are rotated whereby a fluid in thedepression moves at a certain speed toward the end of the depression inthe direction of outer periphery. Then, the fluid sent to the end of thedepression further receives pressure from the depression in thedirection from inner periphery, finally turning to pressure in thedirection of separating the processing surfaces, simultaneously beingintroduced between the processing surfaces. The processing surfacesprovided with a depression are rotated thereby generating a forceexerted in the direction of separating the processing surfaces andintroducing the fluid between the processing surfaces, the effect ofwhich is called a micropump effect. The direction of introducing thefluid caused by the micropump effect does not coincide with thedirection of rotation of the processing surfaces. However, where thereaction actually occurs between the processing surfaces, that is, inthe flow of the fluid between the processing surfaces after the flow inthe introducing direction caused by the micropump effect is cleared, theflow of a spinal laminar flow in the rotation direction is shown, as thenumerical simulation results (Non-Patent Document 2) indicate. That is,there exists where the flow direction caused by the micropump effect isconverted into the rotation direction in the processing surfaces. In itsvicinity, an eddy or the like may be formed to cause flow disturbance.

Further, when the depression arranged on the processing surfaces forproducing the micropump effect is provided too deep, the verticalmicropump effect becomes too large in the radial direction, and themicropump effect extends in the radial direction and further isaccompanied with pulsations, so the formation of a uniform thicknessbetween the processing surfaces may be prevented. This also applies tothe case wherein a total area of the depressions in a horizontaldirection is too large against the processing surfaces. When a totalarea of the depressions in a horizontal direction is too small againstthe processing surfaces, effective introduction of the fluid into theprocessing surfaces from the center of the processing surfaces cannot beachieved.

However, it is not enough to solely consider the volume given bydetermining the total area and depth of the depressions. An average flowof a spiral and laminar one between the processing surfaces cannot besecured without a method of locating the depressions, the whole volumeof which are equally divided and arranged in the center of theprocessing surfaces, and introducing a fluid between the processingsurfaces evenly.

Further, a problem like the above will be caused without providing aspecific shape with the depression in order to introduce a fluid evenly.

Favorable results intended in uniform processing and formation ofmicroparticles between the processing surfaces capable of approaching toand separating from each other, at least one of which rotates relativeto the other, cannot be obtained without solving these problems.

Further, the present inventors have examined introduction of a few kindsof other fluids from another fluid path independent of a flow forintroducing a fluid by the micropump effect from the center ofprocessing surfaces when the following chemical reaction is carried outbetween the processing surfaces capable of approaching to and separatingfrom each other, at least one of which rotates relative to the other.

A+B→C  (1)

C+D→E  (2)

When the reactions in the reaction formulae above are carried outbetween processing surfaces capable of approaching to and separatingfrom each other, at least one of which rotates relative to the other,the order is as follows: First, a fluid containing a material A to beprocessed is introduced by the micropump effect between the processingsurfaces. Then, a fluid containing a material B to be processed isintroduced between the processing surfaces through a flow pathindependent of the flow path for introducing the fluid containing amaterial A to be processed. The material A is reacted with the materialB to form a product C. Further, a material D to be processed isintroduced into a flow path independent of the flow path for introducingthe fluid containing a material A to be processed, and the flow path forintroducing the fluid containing a material B to be processed. Theproduct C is reacted with the material D to form a product E.

In a case where various materials to be processed as described above arereacted with one another by simultaneously introducing into theprocessing surfaces capable of approaching to and separating from eachother, at least one of which rotates relative to the other, productionof the final processed material E is adversely affected when each of theflow paths independent of the flow for introducing the fluid containinga material A to be processed is arranged in arbitrary places. That is,there is a problem that in spite of the fact that A, B, C and D areoriginally reacted in this order to give the product E, this order maynot be followed such that the reaction A+B+C→ the product E, thereaction of which is not due to the original reaction process, occurs toproduce a different substance. In contrast, the processed materials maynot be efficiently contacted with one another, and thus the reaction maynot be carried out, or a substance in poor production such as aprocessed material B′ may be generated, or the yield of the product Emay be decreased, so that there is a problem that the objective particlediameter, crystal form, and molecular structure may not be obtained.When the processed material after being processed needs to be, forexample, temperature-controlled, its mechanism is not concretelyestablished, so there is a problem that the material is subjected onceto change in temperature.

Based on the phenomenon described above, the present invention furtherimproves the apparatus in Patent Document 4 and provides a fluidprocessing apparatus and a processing method capable of carrying outmore stable and uniform processing.

That is, in an apparatus wherein a material to be processed is processedbetween processing surfaces capable of approaching to and separatingfrom each other, at least one of which rotates relative to the other,when a fluid containing a material to be processed is introduced betweenthe processing surfaces by a micropump effect from the center of therotating processing surfaces, and when at least another fluid containinga material to be processed is introduced between the processing surfacesfrom another flow path that is independent of the flow path forintroducing the first fluid and is provided with an opening leading tothe processing surfaces, the direction and angle of introduction and thediameter of the opening are allowed to be in a specific range, andsimultaneously, the place and the number of the introduction aredetermined depending on the objective processing form. Further, therange of the depth, area, shape and numbers of depressions arranged onthe processing surfaces is set so that the problem described above canbe solved. Further, the mechanism in which a fluid containing a productobtained between the processing surfaces is charged directly into anexternal fluid of processing members is arranged thereby solving theabove problem.

On the other hand, when a fluid is processed between processing surfacesin the apparatus with the mechanism shown in Patent Document 4,improvement on speed of temperature homogenization, improvement on speedof homogenization of concentration, and reduction in processing time insupport of molecular diffusion, which have been attempted as describedabove, cannot be completely achieved if the processing with stirring andmixing is carried out only with a spiral laminar flow between theprocessing surfaces. Accordingly, the present inventor has extensivelystudied and found that in an apparatus wherein a fluid containing amaterial to be processed is introduced between processing surfacescapable of approaching to and separating from each other, at least oneof which rotates relative to the other, and at least another fluidcontaining a material to be processed is introduced between theprocessing surfaces from another flow path that is independent of theflow path for introducing the first fluid and is provided with anopening leading to the processing surfaces, whereby the processing isdone by mixing and stirring between the processing surfaces, a processbetween the processing surfaces can be carried out more efficiently andeffectively than ever by generating a flow perpendicular to theprocessing surfaces, in addition to a spiral laminar flow between theprocessing surfaces.

Based on the phenomenon described above, the present invention furtherimproves the apparatus in Patent Document 4 and provides a fluidprocessing apparatus and a processing method capable of carrying outmore stable and uniform processing by generating, between the processingsurfaces, a flow perpendicular to the processing surfaces.

DISCLOSURE OF INVENTION

In order to solve the problems described above, an aspect of theinvention of claim 1 in the present application provides a fluidprocessing apparatus for processing a material to be processed betweenprocessing surfaces in processing members capable of approaching to andseparating from each other, at least one of which rotates relative tothe other, and a first fluid containing a material to be processed isintroduced between the processing surfaces by a micropump effect in adepression arranged on at least one of the processing surfaces frominside to outside of the radial direction of the rotating processingsurfaces, and a second fluid containing a material to be processed isintroduced between the processing surfaces from another flow path thatis independent of the flow path for introducing the first fluid and isprovided with an opening leading to the processing surfaces, whereby theprocessing is done by mixing and stirring between the processingsurfaces, wherein, in a plane along the processing surfaces,directionality accompanies the introducing direction from the opening ofthe second fluid into the processing surfaces, and, regarding theintroducing direction of the second fluid, it is an outward directionaway from the center for the fluid in the radial direction of theprocessing surface, and it is a forward direction for the fluid in therotation direction of the fluid between the rotating processingsurfaces.

An aspect of the invention of claim 2 in the present applicationprovides the fluid processing apparatus according to claim 1, whereinthe introducing direction from the opening of the second fluid into theprocessing surfaces is inclined relative to the processing surfaces.

An aspect of the invention of claim 3 in the present applicationprovides the fluid processing apparatus according to claim 1 or 2,wherein the bore diameter of the opening or the diameter of the flowpath is 0.2 μm to 3000 μm.

An aspect of the invention of claim 4 in the present applicationprovides the fluid processing apparatus according to anyone of claims 1to 3, wherein the micropump effect produces an effect such that a forceis generated in the direction of separating the processing surfaces fromeach other by rotating the processing surfaces provided with adepression, and further a fluid is introduced into the processingsurfaces.

According to each aspect of the invention, even if the process iscarried out by a reaction accompanied by separation at high reactionspeed, a problem such that substances to be separated would causeclogging in the vicinity of the opening in the processing surfaces canbe solved, and further the disturbance of a spiral laminar flow that isa fluid formed between the processing surfaces, due to the flow of afluid introduced through the opening, can be minimized. Accordingly,intended favorable results such as homogeneous processing and formationof microparticles can be obtained. Here, the micropump effect accordingto the present invention produces an effect such that a force isgenerated in the direction of separating the processing surfaces fromeach other by rotating the processing surfaces provided with adepression, and further a fluid is introduced into the processingsurfaces.

An aspect of the invention of claim 5 in the present applicationprovides the fluid processing apparatus according to any one of claims 1to 4, wherein the depression arranged on the processing surfaces has adepth of 1 μm to 50 μm.

An aspect of the invention of claim 6 in the present applicationprovides the fluid processing apparatus according to any one of claims 1to 5, wherein a total plane area of the depressions arranged on theprocessing surfaces is 5% to 50% of the total plane of the processingsurfaces provided with the depressions.

An aspect of the invention of claim 7 in the present applicationprovides the fluid processing apparatus according to any one of claims 1to 6, wherein the number of the depressions arranged on the processingsurfaces is 3 to 50.

An aspect of the invention of claim 8 in the present applicationprovides the fluid processing apparatus according to any one of claims 1to 7, wherein the depression arranged on the processing surfaces is atleast one kind selected from a depression extending in a curved form, adepression extending in a spiral form, a depression extending in bendingat a right angle and a depression having depth changing continuously, inits plane form.

According to each aspect of the invention, a fluid in a broad viscosityfrom low to high viscosity can be introduced between the processingsurfaces, and the distance between the processing surfaces can befurther strictly fixed and secured.

An aspect of the invention of claim 9 in the present applicationprovides the fluid processing apparatus according to any one of claims 1to 8, wherein the opening in the separate flow path is arranged at aposition nearer to the outer diameter than a position where thedirection of a flow upon introduction by the micropump effect from thedepression arranged on the processing surfaces is converted into thedirection of a spiral laminar flow formed between the processingsurfaces.

An aspect of the invention of claim 10 in the present applicationprovides the fluid processing apparatus according to any one of claims 1to 9, wherein the opening in the separate flow path is arranged in aplace apart 0.5 mm or more from the outermost side in the radialdirection of the processing surfaces of the depression arranged on theprocessing surfaces to the outside in the radial direction.

According to each aspect of the invention, a process in a turbulentregion generated between the processing surfaces can be prevented, and aprocess can be carried out in a spiral laminar flow region in therotation direction of the processing surfaces.

An aspect of the invention of claim 11 in the present applicationprovides the fluid processing apparatus according to any one of claims 1to 10, wherein a plurality of the openings are arranged for the samekinds of fluids, and the plurality of the openings for the same kinds offluids are concentrically arranged.

An aspect of the invention of claim 12 in the present applicationprovides the fluid processing apparatus according to any one of claims 1to 11, wherein a plurality of the openings are arranged for thedifferent kinds of fluids, and the plurality of the openings for thedifferent kinds of fluids are concentrically arranged.

According to each aspect of the invention, even if at least two kinds offluids each containing a material to be processed are simultaneouslyintroduced between the processing surfaces through a flow path otherthan the flow path for introducing a fluid by the micropump effect, thereaction such as cases (1) A+B→C and (2) C+D→E should occur in dueorder, and problems such that a reaction such as A+B+C→F that should notbe originally and simultaneously reacted is performed, and materials tobe processed are not efficiently contacted with each other to cause anintended reaction to fail to carry out can be prevented.

An aspect of the invention of claim 13 in the present applicationprovides the fluid processing apparatus according to any one of claims 1to 12, wherein the processing members are dipped in a fluid, and a fluidobtained by processing between the processing surfaces is directly fedinto a liquid outside the processing members or into a gas other thanair.

An aspect of the invention of claim 14 in the present applicationprovides the fluid processing apparatus according to any one of claims 1to 13, wherein ultrasonic energy can be applied to the processedmaterial just after being discharged from the space between theprocessing surfaces or from the processing surfaces.

According to each aspect of the invention, even if the processedmaterial after being processed needs to be, for example,temperature-controlled, a problem of undergoing temperature change oncecan be prevented by keeping the temperature of a liquid outside theprocessing members or a gas other than air in constant. When a gasoutside the processing members is charged into an inert gas such asnitrogen, oxidation or the like can be prevented. By applying ultrasonicenergy to the space between the processing surfaces, it is furtherpossible to use for reducing processing time by promoting the processbetween the processing surfaces, promoting crystallization, andsuppressing aggregation of separated particles. By applying ultrasonicenergy to the processed material just after being discharged from theprocessing surfaces, it is possible to use for suppressing aggregationor aging of separated particles.

An aspect of the invention of claim 15 in the present applicationprovides a method of processing a fluid, wherein the fluid processingapparatus of any one of claims 1 to 14 is used so that a first fluidcontaining a material to be processed is introduced between processingsurfaces by a micropump effect in a depression arranged on at least oneof the processing surfaces from inside to outside of the radialdirection of the rotating processing surfaces, a second fluid containinga material to be processed is introduced between the processing surfacesfrom another flow path that is independent of the flow path forintroducing the first fluid and is provided with an opening leading tothe processing surfaces, whereby the these are reacted with each otherby mixing and stirring between the processing surfaces.

An aspect of the invention of claim 16 in the present applicationprovides a fluid processing apparatus, wherein at least two kinds offluids are used, at least one kind of which contains at least a kind ofmaterial to be processed, the fluids join together between processingsurfaces capable of approaching to and separating from each other, atleast one of which rotates relative to the other to form a thin filmfluid, and the material is processed in the thin film fluid, and whereina fluid between the processing surfaces is processed by giving atemperature gradient.

An aspect of the invention of claim 17 in the present applicationprovides the fluid processing apparatus according to claim 16, whereinof the processing surfaces, the temperature of one of the processingsurfaces is made higher than that of the other processing surface,thereby giving a temperature gradient in the fluid between theprocessing surfaces.

An aspect of the invention of claim 18 in the present applicationprovides the fluid processing apparatus according to claim 17, whereinthe temperature difference between one of the processing surfaces andthe other processing surface is 1° C. to 400° C.

An aspect of the invention of claim 19 in the present applicationprovides the fluid processing apparatus according to any one of claims16 to 18, wherein the processing surfaces in processing members arearranged to be opposite to each other so as to be able to approach toand separate from each other, at least one of which rotates relative tothe other, and the processing members are provided with a temperatureregulating mechanism for cooling and heating the processing surfaces.

An aspect of the invention of claim 20 in the present applicationprovides the fluid processing apparatus according to claim 19, whereinthe temperature regulating mechanism is at least one member selectedfrom a pipe for passing a temperature regulating medium, a coolingelement, and a heating element.

An aspect of the invention of claim 21 in the present applicationprovides the fluid processing apparatus according to any one of claims16 to 20, wherein a flow of the fluid between the processing surfaces isgenerated by the temperature gradient, and a directional factor of thisflow contains at lease a directional factor perpendicular to theprocessing surfaces.

According to each aspect of the invention, speed of temperaturehomogenization and speed of homogenization of concentration can beimproved more than ever, and further reduction in processing time can berealized.

An aspect of the invention of claim 22 in the present applicationprovides the fluid processing apparatus according to any one of claims16 to 21, wherein Benard convection or Marangoni convection is generatedin the fluid between the processing surfaces by the temperaturegradient.

An aspect of the invention of claim 23 in the present applicationprovides the fluid processing apparatus according to any one of claims16 to 22, wherein the temperature difference ΔT between the processingsurfaces and the distance L between the processing surfaces satisfy thefollowing condition:

Rayleigh number Ra defined by the following equation is 1700 or more:

Ra=L ³ ·g·β·ΔT/(α·ν)

wherein g is gravitational acceleration; β is coefficient of volumetricthermal expansion of fluid; ν is dynamic viscosity of fluid; and α isheat diffusivity of fluid.

An aspect of the invention of claim 24 in the present applicationprovides the fluid processing apparatus according to any one of claims16 to 22, wherein the temperature difference ΔT between the processingsurfaces and the distance L between the processing surfaces satisfy thefollowing condition:

Marangoni number defined by the following equation is 80 or more:

Ma=σ·ΔT·L/(ρ·ν·α)

wherein ν is dynamic viscosity of fluid; α is heat diffusivity of fluid;ρ is density of fluid; and σ is temperature coefficient of surfacetension (temperature gradient of surface tension).

According to each aspect of the invention, the condition of generating aflow of the fluid between the processing surfaces can be determined bythe distance and temperature difference between the processing surfaces.

An aspect of the invention of claim 25 in the present applicationprovides a method of processing a fluid, wherein at least two kinds offluids are reacted with each other by mixing and stirring between theprocessing surfaces using the fluid processing apparatus of any one ofclaims 16 to 24.

An aspect of the invention of claim 26 in the present applicationprovides a fluid processing apparatus, wherein at least two kinds offluids are used, at least one kind of which contains at least a kind ofmaterial to be processed, the fluids join together between processingsurfaces capable of approaching to and separating from each other, atleast one of which rotates relative to the other to form a thin filmfluid, and the material is processed in the thin film fluid, and whereinat least one of the processing surfaces is provided with a depressionfor introducing a material to be processed between the processingsurfaces, a processing member opposite to the processing member providedwith a depression is provided with an inclined surface, the inclinedsurface, based on the flowing direction of the processed fluid, isformed such that the distance in the axial direction between theupstream end and the processing surface of the opposite processingmember is made larger than the distance between the downstream end andthe aforesaid processing surface, and the downstream end of the inclinedsurface is arranged on the projected area in the axial direction of thedepression.

An aspect of the invention of claim 27 in the present applicationprovides the fluid processing apparatus according to claim 26, wherein,in the processing member provided with the inclined surface, the angleof the inclined surface to the processing surfaces is in the range of0.1° to 85°.

According to each of the inventions, the processed material can beuniformly introduced.

In the invention of the present application, there can be provided afluid processing apparatus and a processing method capable of carryingout more stable and uniform processing. For example, there can beprovided a fluid processing apparatus and a processing method in whichwhen a material to be processed is processed between processing surfacesin processing members capable of approaching to and separating from eachother, at least one of which rotates relative to the other, even if theprocess is carried out by a reaction accompanied by separation at highreaction speed, a problem such that substances to be separated wouldcause clogging in the vicinity of the opening in the processing surfacescan be prevented, and further the disturbance of a spiral laminar flowthat is a fluid formed between the processing surfaces, due to the flowof a fluid introduced through the opening, can be reduced. In addition,a fluid in a broad viscosity from low to high viscosity can beintroduced between the processing surfaces, and a process in a turbulentflow or a region of disrupted flow formed between the processingsurfaces can be prevented, and a process in a spiral laminar flow in therotation direction between the processing surfaces can be carried out.Further, even if at least two kinds of fluids each containing a materialto be processed are simultaneously introduced into the processingsurfaces through a flow path different from the flow path forintroducing a fluid by the micropump effect, the reaction such as cases(1) A+B→C and (2) C+D→E should occur in due order, and problems suchthat a reaction such as A+B+C→F that should not be originally andsimultaneously reacted is performed, and materials to be processed arenot efficiently contacted with each other to cause an intended reactionto fail to carry out can be prevented.

As a result, uniform processing conditions between the processingsurfaces can be provided and therefore, improvement on speed oftemperature homogenization, improve on speed of homogenization ofconcentration, and reduction in processing time in support of moleculardiffusion can be achieved more effectively than ever.

According to the invention of the present application, it is possible toimprove speed of temperature homogenization, speed of homogenization ofconcentration, and to reduce processing time, upon processing in a microflow path more than ever by giving a temperature gradient to processingsurfaces to carry out processing in an apparatus wherein a first fluidcontaining a material to be processed is introduced between theprocessing surfaces in processing members capable of approaching to andseparating from each other, at least one of which rotates relative tothe other, and a second fluid containing a material to be processed isintroduced between the processing surfaces from another flow path thatis independent of the flow path for introducing the first fluid and isprovided with an opening leading to the processing surfaces, whereby thetwo fluids are processed by mixing and stirring between the processingsurfaces. Accordingly, the present invention can provide a fluidprocessing apparatus and a processing method capable of carrying outmore stable and uniform processing compared to the apparatus in PatentDocument 1. Further, even when the distance between the processingsurfaces is large, the uniformity between the processing surfaces is notdeteriorated and thus the throughput can be further increased.

In the invention of the present application, a material to be processedcan be uniformly introduced by forming a pressure-receiving surface 23.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic vertical sectional view showing outline of theapparatus of the present invention.

FIG. 2(A) is a schematic plane view of the first processing surface inthe apparatus shown in FIG. 1, and FIG. 2(B) is an enlarged view showingan important part of the first processing surface in the apparatus shownin FIG. 1.

FIG. 3(A) is a sectional view of the second introduction path, and FIG.3(B) is an enlarged view showing an important part of the processingsurface for explaining the second introduction path.

FIG. 4(A) is a schematic vertical sectional view showing the concept ofthe apparatus used for carrying out the present invention, FIG. 4(B) isa schematic vertical sectional view showing the concept of anotherembodiment of the apparatus, FIG. 4(C) is a schematic vertical sectionalview showing the concept of still another embodiment of the apparatus,and FIG. 4(D) is a schematic vertical sectional view showing the conceptof still another embodiment of the apparatus.

FIG. 5(A) to FIG. 5(D) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 4.

FIG. 6(A) is a schematic bottom view showing an important part of theapparatus shown in FIG. 5(C), FIG. 6(B) is a schematic bottom viewshowing an important part of another embodiment of the apparatus, FIG.6(C) is a schematic bottom view showing an important part of stillanother embodiment of the apparatus, FIG. 6(D) is a schematic bottomview showing the concept of still another embodiment of the apparatus,FIG. 6(E) is a schematic bottom view showing the concept of stillanother embodiment of the apparatus, and FIG. 6(F) is a schematic bottomview showing the concept of still another embodiment of the apparatus.

FIG. 7(A) to FIG. 7(D) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1.

FIG. 8(A) to FIG. 8(D) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1.

FIG. 9(A) to FIG. 9(D) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1.

FIG. 10(A) to FIG. 10(D) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1.

FIG. 11(A) to FIG. 11(D) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1.

FIG. 12(A) to FIG. 12(C) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1.

FIG. 13(A) to FIG. 13(D) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1.

FIG. 14(A) and FIG. 14(B) each show a schematic vertical sectional viewshowing the concept of still another embodiment of the apparatus shownin FIG. 1, and FIG. 14(C) is a schematic bottom view showing animportant part of the apparatus shown in FIG. 4(A).

FIG. 15(A) is a schematic vertical sectional view showing an importantpart of another embodiment of a pressure-receiving surface in theapparatus shown in FIG. 4(A), and FIG. 15(B) is a schematic verticalsectional view showing an important part of still another embodiment ofthe apparatus.

FIG. 16 is a schematic vertical sectional view showing an important partof another embodiment of a surface-approaching pressure impartingmechanism in the apparatus shown in FIG. 15(A).

FIG. 17 is a schematic vertical sectional view showing an important partof another embodiment of the apparatus shown in FIG. 15(A), which isprovided with a temperature-regulating jacket.

FIG. 18 is a schematic vertical sectional view showing an important partof still another embodiment of the surface-approaching pressureimparting mechanism in the apparatus shown in FIG. 15(A).

FIG. 19(A) is a schematic transverse sectional view showing an importantpart of still another embodiment of the apparatus shown in FIG. 15(A),FIG. 19(B), FIG. 19(C), and FIG. 19(E) to FIG. 19(G) are schematictransverse sectional views each showing an important part of stillanother embodiment of the apparatus, and FIG. 19(D) is a partially cutschematic vertical sectional view showing an important part of stillanother embodiment of the apparatus.

FIG. 20 is a schematic vertical sectional view showing an important partof still another embodiment of the apparatus shown in FIG. 15(A).

FIG. 21(A) is a schematic vertical sectional view showing the concept ofstill another embodiment of the apparatus used for carrying out thepresent invention, and FIG. 21(B) is a partially cut explanatory viewshowing an important part of the apparatus.

FIG. 22(A) is a plane view of a first processing member in the apparatusshown in FIG. 15, and FIG. 22(B) is a vertical sectional view showing animportant part thereof.

FIG. 23(A) is a schematic vertical sectional view showing an importantpart of first and second processing members in the apparatus shown inFIG. 15, and FIG. 23(B) is a schematic vertical sectional view showingan important part of the first and second processing members with aminute gap.

FIG. 24(A) is a plane view of another embodiment of the first processingmember, and FIG. 24(B) is a schematic vertical sectional view showing animportant part thereof.

FIG. 25(A) is a plane view of still another embodiment of the firstprocessing member, and FIG. 25(B) is a schematic vertical sectional viewshowing an important part thereof.

FIG. 26(A) is a plane view of still another embodiment of the firstprocessing member, and FIG. 26(B) is a plane view of still anotherembodiment of the first processing member.

FIG. 27(A), FIG. 27(B), and FIG. 27(C) are diagrams showing embodimentsother than those described above with respect to the method ofseparating a processed material after processing.

FIG. 28(A) and FIG. 28(B) are each an enlarged sectional view of animportant part for explaining an inclined surface arranged in theprocessing member.

FIG. 29 is a diagram for explaining a pressure-receiving surfacearranged in the processing member, and FIG. 29(A) is a bottom view ofthe second processing member, and FIG. 29(B) is an enlarged sectionalview of an important part.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, preferable embodiments of the present invention will bedescribed with reference to the drawings. FIG. 1 is a schematicsectional view of a fluid processing apparatus wherein materials to beprocessed are reacted between processing surfaces, at least one of whichrotates relative to the other, and which are capable of approaching toand separating from each other. FIG. 2(A) is a schematic plane view ofthe first processing surface in the apparatus shown in FIG. 1, and FIG.2(B) is an enlarged view of an important part of the processing surfacein the apparatus shown in FIG. 1. FIG. 3(A) is a sectional view of thesecond introduction path, and FIG. 3(B) is an enlarged view of animportant part for explaining the second introduction path.

In FIG. 1, arrows U and S show upward and downward directionsrespectively.

In FIG. 2(A) and FIG. 3(B), arrow R shows the direction of rotation.

In FIG. 3(B), arrow C shows the direction of centrifugal force (radialdirection).

This apparatus uses at least two fluids, at least one of which containsat least one kind of material to be processed, and the fluids jointogether in the space between the processing surfaces arranged to beopposite so as to be able to approach to and separate from each other,at least one of which rotates relative to the other, thereby forming athin film fluid, and the materials to be processed are processed in thethin film fluid. The term “processing” is not limited to a process wherethe material is reacted, and includes a process where the material isonly mixed and dispersed without accompanying any reaction.

As shown in FIG. 1, this apparatus includes a first holder 11, a secondholder 21 arranged over the first holder 11, a fluid pressure impartingmechanism P and a surface-approaching pressure imparting mechanism. Thesurface-approaching pressure imparting mechanism is comprised of aspring 43 and an air introduction part 44.

The first holder 11 is provided with a first processing member 10 and arotary shaft 50. The first processing member 10 is a circular bodycalled a mating ring and provided with a mirror-polished firstprocessing surface 1. The rotary shaft 50 is fixed to the center of thefirst holder 11 with a fixing device 81 such as a bolt and is connectedat its rear end to a rotation drive device 82 (rotation drive mechanism)such as a motor, and the drive power of the rotation drive device 82 istransmitted to the first holder 1 thereby rotating the first holder 11.The first processing member 10 is integrated with the first holder 11and rotated.

A receiving part capable of receiving the first processing member 10 isarranged on the upper part of the first holder 11, wherein the firstprocessing member 10 has been fixed to the first holder 11 by insertionto the receiving part. The first processing member 10 has been fixedwith a rotation-preventing pin 83 so as not to be rotated relative tothe first holder 11. However, a method such as fitting by burning may beused for fixing in place of the rotation-preventing pin 83 in order toprevent rotation.

The first processing surface 1 is exposed from the first holder 11 andfaced with the second holder 21. The material for the first processingsurface includes ceramics, sintered metal, abrasion-resistant steel,other hardened metals, and rigid materials subjected to lining, coatingor plating.

The second holder 21 is provided with a second processing member 20, afirst introduction part d1 for introducing a fluid from the inside ofthe processing member, a spring 43 as a surface-approaching pressureimparting mechanism, and an air introduction part 44.

The second processing member 20 is a circular member called acompression ring and includes a second processing surface 2 subjected tomirror polishing and a pressure-receiving surface 23 (referred tohereinafter as separation regulating surface 23) which is located insidethe second processing surface 2 and adjacent to the second processingsurface 2. As shown in the figure, the separation regulating surface 23is an inclined surface. The method of the mirror polishing to which thesecond processing surface 2 was subjected is the same as that to thefirst processing surface 1. The material for the second processingmember 20 may be the same as one for the first processing member 10. Theseparation regulating surface 23 is adjacent to the inner periphery 25of the circular second processing member 20.

A ring-accepting part 41 is formed in the bottom (lower part) of thesecond holder 21, and the second processing member 20 together with anO-ring is accepted in the ring-accepting part 41. The second processingmember 20 is accepted with a rotation preventive 84 so as not to berotated relative to the second holder 21. The second processing surface2 is exposed from the second holder 21. In this state, the secondprocessing surface 2 is faced with the first processing surface 1 of thefirst processing member 10.

The ring-accepting part 41 arranged in the second holder 21 is adepression for mainly accepting that side of the second ring 20 which isopposite to the processing surface 2 and is a groove formed in acircular form when viewed in a plane.

The ring-accepting part 41 is formed in a larger size than the secondring 20 and accepts the second ring 20 with sufficient clearance betweenitself and the second ring 20.

By this clearance, the second processing member 20 is accepted in thering-accepting part 41 such that it can be displaced not only in theaxial direction of the accepting part 41 but also in a directionperpendicular to the axial direction. The second processing member 20 isaccepted in the ring-accepting part 41 such that the central line (axialdirection) of the second processing member 20 can be displaced so as notto be parallel to the axial direction of the ring-accepting part 41.

The spring 43 is arranged as a processing member-biasing part in atleast the ring-accepting part 41 of the second holder 21. The spring 43biases the second processing member 20 toward the first processingmember 10. As another bias method, air pressure such as one in the airintroduction part 44 or another pressurization means for applying fluidpressure may be used to bias the second processing member 20 held by thesecond holder 21 in the direction of approaching the second processingmember 20 to the first processing member 10.

The surface-approaching pressure imparting mechanism such as the spring43 or the air introduction part 44 biases each position (each positionin the processing surface) in the circumferential direction of thesecond processing member 20 evenly toward the first processing member10.

The first introduction part d1 is arranged on the center of the secondholder 21, and the fluid which is pressure-fed from the firstintroduction part d1 to the outer periphery of the processing member isfirst introduced into the space surrounded with the second processingmember 20 held by the second holder 21, the first processing member 10,and the first holder 11 that holds the first processing member 10. Then,the feeding pressure (supply pressure) of the fluid by the fluidpressure imparting mechanism P is applied to the pressure-receivingsurface 23 arranged in the second processing member 20, in the directionof separating the second processing member 20 from the first processingmember 10 against the bias of the biasing part.

For simplifying the description of other components, only thepressure-receiving surface 23 is described, and as shown in FIG. 29(A)and FIG. 29(B), properly speaking, together with the pressure-receivingsurface 23, apart 23X not provided with the pressure-receiving surface23, out of the projected area in the axial direction relative to thesecond processing member 20 in a grooved depression 13 described later,serves as a pressure-receiving surface and receives the feeding pressure(supply pressure) of the fluid by the fluid pressure imparting mechanismP.

The apparatus may not be provided with the pressure-receiving surface23. In this case, as shown in FIG. 26(A), the effect (micro-pump effect)of introduction of the processed fluid into the space between theprocessing surfaces formed by rotation of the first processing surface 1provided with the grooved depression 13 formed to function thesurface-approaching pressure imparting mechanism may be used. Themicro-pump effect is an effect by which the fluid in the depressionadvances with speed toward the end in the circumferential direction byrotation of the first processing surface 1 and then the fluid sent tothe end of the depression 13 further receives pressure in the directionof inner periphery of the depression 13 thereby finally receivingpressure in the direction of separating the processing surface andsimultaneously introducing the fluid into the space between theprocessing surfaces. Even if the first processing surface 1 is notrotated, the pressure applied to the fluid in the depression 13 arrangedin the first processing surface 1 finally acts on the second processingsurface 2 to be separated as a pressure-receiving surface.

For the depression 13 arranged on the processing surface, its total areain the horizontal direction relative to the processing surface, and thedepth, number, and shape of depressions, can be established depending onthe physical properties of a fluid containing reactants and reactionproducts.

The pressure-receiving surface 23 and the depression 13 may be arrangedin the same apparatus.

The depression 13 is a depression having a depth of 1 μm to 50 μm,preferably 3 μm to 20 μm, which is arranged on the processing surface,the total area thereof in the horizontal direction is 5% to 50%,preferably 15% to 25%, based on the whole of the processing surface, thenumber of depressions is 3 to 50, preferably 8 to 24, and the depressionextends in a curved or spiral form on the processing surface or bends ata right angle, having depth changing continuously, so that fluids withhigh to low viscosity, even containing solids, can be introduced intothe space between the processing surfaces stably by the micro-pumpeffect. The depressions arranged on the processing surface may beconnected to one another or separated from one another in the side ofintroduction, that is, inside the processing surface.

As described above, the pressure-receiving surface 23 is inclined. Thisinclined surface (pressure-receiving surface 23) is formed such that thedistance in the axial direction between the upstream end in thedirection of flow of the processed fluid and the processing surface ofthe processing member provided with the depression 13 is longer than thedistance between the downstream end and the aforesaid processingsurface. The downstream end of this inclined surface in the direction offlow of the processed fluid is arranged preferably on the projected areain the axial direction of the depression 13. By formation of thepressure-receiving surface 23, the material to be processed can beintroduced uniformly.

Specifically, as shown in FIG. 28(A), a downstream end 60 of theinclined surface (pressure-receiving surface 23) is arranged on theprojected area in the axial direction of the depression 13. The angle θ1of the inclined surface to the second processing surface 2 is preferablyin the range of 0.1° to 85°, more preferably in the range of 10° to 55°,still more preferably in the range of 15° to 45°. The angle θ1 can varydepending on properties of the processed product before processing. Thedownstream end 60 of the inclined surface is arranged in the regionextending from the position apart downstream by 0.01 mm from an upstreamend 13-b to the position apart upstream by 0.5 mm from a downstream end13-c in the depression 13 arranged in the first processing surface 1.The downstream end 60 of the inclined surface is arranged morepreferably in the region extending from the position apart downstream by0.05 mm from the upstream end 13-b to the position apart upstream by 1.0mm from the downstream end 13-c. Like the angle of the inclined surface,the position of the downstream end 60 can vary depending on propertiesof a material to be processed. As shown in FIG. 28(B), the inclinedsurface (pressure-receiving surface 23) can be a curved surface. Thematerial to be processed can thereby be introduced more uniformly.

The depressions 13 may be connected to one another or separated from oneanother as described above. When the depressions 13 are separated, theupstream end at the innermost peripheral side of the first processingsurface 1 is 13-b, and the upstream end at the outermost peripheral sideof the first processing surface 1 is 13-c.

In the foregoing description, the depression 13 was formed on the firstprocessing surface 1 and the pressure-receiving surface 23 was formed onthe second processing surface 2. On the contrary, the depression 13 maybe formed on the second processing surface 2, and the pressure-receivingsurface 23 may be formed on the first processing surface 1.

Alternatively, the depression 13 is formed both on the first processingsurface 1 and the second processing surface 2, and the depression 13 andthe pressure-receiving surface 23 are alternately arranged in thecircumferential direction of each of the respective processing surfaces1 and 2, whereby the depression 13 formed on the first processingsurface 1 and the pressure-receiving surface 23 formed on the secondprocessing surface 2 are faced with each other and simultaneously thepressure-receiving surface 23 formed on the first processing surface 1and the depression 13 formed on the second processing surface 2 arefaced with each other.

A groove different from the depression 13 can be formed on theprocessing surface. Specifically, as shown in FIG. 19(F) and FIG. 19(G),a radially extending novel depression 14 instead of the depression 13can be formed outward in the radial direction (FIG. 19(F)) or inward inthe radial direction (FIG. 19(G)). This is advantageous for prolongationof retention time between the processing surfaces or for processing ahighly viscous fluid.

The groove different from the depression 13 is not particularly limitedwith respect to the shape, area, number of depressions, and depth. Thegroove can be formed depending on the object.

The second introduction part d2 independent of the fluid flow pathintroduced into the processing surface and provided with the opening d20leading to the space between the processing surfaces is formed on thesecond processing member 20.

Specifically, as shown in FIG. 3(A), the direction of introduction ofthe second introduction part d2 from the opening d20 of the secondprocessing surface 2 is inclined at a predetermined elevation angle (θ1)relative to the second processing surface 2. The elevation angle (θ1) isarranged at more than 0° and less than 90°, and when the reaction speedis high, the angle (θ1) is preferably arranged at 1° to 45°.

As shown in FIG. 3(B), the direction of introduction of the secondprocessing surface 2 from the opening d20 has directionality in a planealong the second processing surface 2. The direction of introduction ofthe second fluid is in the direction in which a component on theprocessing surface is made apart in the radial direction and in thedirection in which the component is forwarded in the rotation directionof the fluid between the rotating processing surfaces. In other words, apredetermined angle (θ2) exists facing the rotation direction R from areference line g in the outward direction and in the radial directionpassing through the opening d20.

The elevation angle (θ1) is arranged at more than 0° and less than 90°,and when the reaction speed is high, the angle (θ1) is preferablyarranged at 1° to 45°.

The angle (θ2) is also arranged at more than 0° and less than 90° atwhich the fluid is discharged from the opening d20 in the shaded regionin FIG. 27(B). When the reaction speed is high, the angle (θ2) may besmall, and when the reaction speed is low, the angle (θ2) is preferablyarranged larger. This angle can vary depending on various conditionssuch as the type of fluid, the reaction speed, viscosity, and therotation speed of the processing surface.

The bore diameter of the opening d20 is preferably 0.2 μm to 3000 μm,more preferably 10 μm to 1000 μm. Even if the bore diameter of theopening d20 is relatively large, the diameter of the second introductionpart d2 shall be 0.2 μm to 3000 μm, more preferably 10 μm unto 1000 μm,and when the diameter of the opening d20 does not substantiallyinfluence the flow of a fluid, the diameter of the second introductionpart d2 may be established in this range. Depending on whether the fluidis intended to be transferred straight or dispersed, the shape of theopening d20 is preferably changed and can be changed depending onvarious conditions such as the type of fluid, reaction speed, viscosity,and rotation speed of the processing surface.

The opening d20 in the separate flow path may be arranged at a positionnearer to the outer diameter than a position where the direction of flowupon introduction by the micro-pump effect from the depression arrangedin the first processing surface 1 is converted into the direction offlow of a spiral laminar flow formed between the processing surfaces.That is, in FIG. 2(B), the distance n from the outermost side in theradial direction of the processing surface of the depression arranged inthe first processing surface 1 to the outside in the radial direction ispreferably 0.5 mm or more. When a plurality of openings are arranged forthe same fluid, the openings are arranged preferably concentrically.When a plurality of openings are arranged for different fluids, theopenings are arranged preferably concentrically in positions differentin radius. This is effective for the reactions such as cases (1) A+B→Cand (2) C+D→E should occur in due order, but other case, i.e., A+B+C→Fshould not occur, or for circumventing a problem that an intendedreaction does not occur due to insufficient contact among reactants.

The processing members are dipped in a fluid, and a fluid obtained byreaction between the processing surfaces can be directly introduced intoa liquid outside the processing members or into a gas other than air.

Further, ultrasonic energy can be applied to the processed material justafter being discharged from the space between the processing surfaces orfrom the processing surface.

As shown in FIG. 1, the case where temperature-regulating mechanisms J1and J2 are arranged in at least one of the first processing member 10and the second processing member 20 for generating a temperaturedifference between the first processing surface 1 and the secondprocessing surface 2 may be allowed.

The temperature regulating mechanism is not particularly limited. Acooling part is arranged in the processing members 10 and 20 whencooling is intended. Specifically, a piping for passing ice water andvarious cooling media or a cooling element such as a Peltier devicecapable of electric or chemical cooling is attached to the processingmembers 10 and 20.

When heating is intended, a heating part is arranged in the processingmembers 10 and 20. Specifically, steam as a temperature regulatingmedium, a piping for passing various hot media, and a heating elementsuch as an electric heater capable of electric or chemical heating isattached to the processing members 10 and 20.

An accepting part for a new temperature regulating medium capable ofdirectly contacting with the processing members may be arranged in thering-accepting part. The temperature of the processing surfaces can beregulated by heat conduction of the processing members. Alternatively, acooling or heating element may be embedded in the processing members 10and 20 and electrified, or a path for passing a cooling medium may beembedded, and a temperature regulating medium (cooling medium) is passedthrough the path, whereby the temperature of the processing surfaces canbe regulated from the inside. By way of example, the temperatureregulating mechanisms J1 and J2 which are pipes (jackets) arrangedinside the processing members 10 and 20 are shown in FIG. 25.

By utilizing the temperature regulating mechanisms J1 and J2, thetemperature of one of the processing surfaces is made higher than thatof the other, to generate a temperature difference between theprocessing surfaces. For example, the first processing member 10 isheated to 60° C. by any of the methods, and the second processing member20 is set at 15° C. by any of the methods. In this case, the temperatureof the fluid introduced between the processing surfaces is changed from60° C. to 15° C. in the direction from the first processing surface 1 tothe second processing surface 2. That is, the fluid between theprocessing surfaces has a temperature gradient. The fluid between theprocessing surfaces initiates convection due to the temperaturegradient, and a flow in a direction perpendicular to the processingsurface is generated. The “flow in a direction perpendicular to theprocessing surface” refers to a flow in which components flowing in adirection perpendicular to at least the processing surface are containedin flowing components.

Even when the first processing surface 1 or the second processingsurface 2 rotates, the flow in a direction perpendicular to theprocessing surface is continued, and thus the flow in a directionperpendicular to the processing surface can be added to a spiral laminarflow between the processing surfaces caused by rotation of theprocessing surfaces. The temperature difference between the processingsurfaces is 1° C. to 400° C., preferably 5° C. to 100° C.

The rotary shaft 50 in this apparatus is not limited to a verticallyarranged shaft. For example, the rotary shaft may be arranged at aslant. This is because the influence of gravity can be substantiallyeliminated by a thin fluid film formed between the processing surfaces 1and 2 during processing. As shown in FIG. 1, the first introduction partd1 coincides with the shaft center of the second ring 20 in the secondholder 21 and extends vertically. However, the first introduction partd1 is not limited to the one coinciding with the shaft center of thesecond ring 20, and as far as it can supply the first processing fluidto the space surrounded with the rings 10 and 20, the part d1 may bearranged at a position outside the shaft center in the central part 22of the second holder 21 and may extend obliquely as well as vertically.Regardless of the angle at which the part d1 is arranged, a flowperpendicular to the processing surface can be generated by thetemperature gradient between the processing surfaces.

When the temperature gradient of the fluid between the processingsurfaces is low, heat conduction merely occurs in the fluid, but whenthe temperature gradient exceeds a certain border value, a phenomenoncalled Benard convection is generated in the fluid. This phenomenon isgoverned by Rayleigh number Ra, a dimensionless number, defined by thefollowing equation:

Ra=L ³ ·g·β·ΔT/(α·ν)

wherein L is the distance between processing surfaces; g isgravitational acceleration; β is coefficient of volumetric thermalexpansion of fluid; ν is dynamic viscosity of fluid; α is heatdiffusivity of fluid; and ΔT is temperature difference betweenprocessing surfaces. The critical Rayleigh number at which Benardconvection is initiated to occur, although varying depending on theproperties of a boundary phase between the processing surface and theprocessed fluid, is regarded as about 1700. At a value higher than thisvalue, Benard convection occurs. Under the condition where the Rayleighnumber Ra is a large value of about 10¹⁰ or more, the fluid becomes aturbulent flow. That is, the temperature difference ΔT between theprocessing surfaces or the distance L between the processing surfaces inthis apparatus are regulated such that the Rayleigh number Ra becomes1700 or more, whereby a flow perpendicular to the processing surface canbe generated between the processing surfaces, and the reactionprocedures described above can be carried out.

However, the Benard convection hardly occurs when the distance betweenthe processing surfaces is about 1 μm to 10 μm. Strictly, when theRayleigh number is applied to a fluid between the processing surfaceshaving a distance of 10 μm or less therebetween to examine theconditions under which Benard convection is generated, the temperaturedifference should be several thousands of degrees or more in the case ofwater, which is practically difficult. Benard convection is one relatedto density difference in temperature gradient of a fluid, that is, togravity. When the distance between the processing surfaces is 10 μm orless, there is high possibility of minute gravity field, and in such aplace, buoyancy convection is suppressed. That is, it is the case wherethe distance between the processing surfaces is 10 μm or more thatBenard convection actually occurs.

When the distance between the processing surfaces is about 1 μm to 10μm, convection is generated not due to density difference but due tosurface tension difference of a fluid resulting from temperaturegradient. Such convection is Marangoni convection. This phenomenon isgoverned by Marangoni number Ma, a dimensionless number, defined by thefollowing equation:

Ma=σ·ΔT·L/(ρ·ν·α)

wherein L is the distance between processing surfaces; ν is dynamicviscosity of fluid; α is heat diffusivity of fluid; ΔT is temperaturedifference between processing surfaces; ρ is density of fluid; and σ istemperature coefficient of surface tension (temperature gradient ofsurface tension). The critical Marangoni number at which Marangoniconvection is initiated to occur is about 80, and under the conditionswhere the Marangoni number is higher than this value, Marangoniconvection occurs. That is, the temperature difference ΔT between theprocessing surfaces or the distance L between the processing surfaces inthis apparatus is regulated such that the Marangoni number Ma becomes 80or more, whereby a flow perpendicular to the processing surface can begenerated between the processing surfaces even if the distancetherebetween is as small as 10 μm or less, and the reaction proceduresdescribed above can be carried out.

For calculation of Rayleigh number, the following equations were used.

$\begin{matrix}{{{Ra} = {\frac{L^{3} \cdot \beta \cdot g}{v \cdot \alpha}\Delta \; T}}{{\Delta \; T} = \left( {T_{1} - T_{0}} \right)}{\alpha = \frac{k}{\rho \cdot C_{p}}}} & \left\lbrack {{Equation}\mspace{14mu} 1} \right\rbrack\end{matrix}$

L is the distance (m) between processing surfaces; β is coefficient ofvolumetric thermal expansion (1/K); g is gravitational acceleration(m/s²); ν is dynamic viscosity (m²/s); α is heat diffusivity (m²/s); ΔTis temperature difference (K) between processing surfaces; ρ is density(kg/m³); Cp is isobaric specific heat (J/kg·K); k is heat conductivity(W/m·K); T₁ is temperature (K) at high temperature side in processingsurface; and T₀ is temperature (K) at low temperature side in processingsurface.

When the Rayleigh number at which Benard convection is initiated tooccur is the critical Rayleigh number Ra_(C), the temperature differenceΔT_(C1) is determined as follows:

$\begin{matrix}{{\Delta \; T_{C\; 1}} = \frac{{Ra}_{C} \cdot v \cdot \alpha}{L^{3} \cdot \beta \cdot g}} & \left\lbrack {{Equation}\mspace{14mu} 2} \right\rbrack\end{matrix}$

For calculation of Marangoni number, the following equations were used.

$\begin{matrix}{{{Ma} = {\frac{\sigma_{t} \cdot L}{\rho \cdot v \cdot \alpha}\Delta \; T}}{{\Delta \; T} = \left( {T_{1} - T_{0}} \right)}{\alpha = \frac{k}{\rho \cdot C_{p}}}} & \left\lbrack {{Equation}\mspace{14mu} 3} \right\rbrack\end{matrix}$

L is the distance (m) between processing surfaces; ν is dynamicviscosity (m²/s); α is heat diffusivity (m²/s); ΔT is temperaturedifference (K) between processing surfaces; ρ is density (kg/m³); Cp isisobaric specific heat (J/kg·K); k is heat conductivity (W/m·K); σ_(t)is surface tension temperature coefficient (N/m·k); T₁ is temperature(K) of a high-temperature surface out of processing surface; and T₀ istemperature (K) of a low-temperature surface out of processing surface.

When the Marangoni number at which Marangoni convection is initiated tooccur is the critical Marangoni number Ma_(C), the temperaturedifference ΔT_(C2) is determined as follows:

$\begin{matrix}{{\Delta \; T_{C\; 2}} = \frac{{Ma}_{C} \cdot \rho \cdot v \cdot \alpha}{\sigma_{t} \cdot L}} & \left\lbrack {{Equation}\mspace{14mu} 4} \right\rbrack\end{matrix}$

Hereinafter, a liquid processing apparatus suitable for carrying out thepresent invention, including the parts described above and other parts,will be described.

As shown in FIG. 4(A), this apparatus includes opposing first and secondprocessing members 10 and 20, at least one of which rotates to theother. The opposing surfaces of both the processing members 10 and 20serve as processing surfaces to process a fluid to be processedtherebetween. The first processing member 1 includes a first processingsurface 1, and the second processing member 20 includes a secondprocessing surface 2.

Both the processing surfaces 1 and 2 are connected to a flow path of thefluid to constitute a part of the flow path of the fluid.

Specifically, this apparatus constitutes flow paths of at least twofluids to be processed and joins the flow paths together.

That is, this apparatus is connected to a flow path of a first fluid toform a part of the flow path of the first fluid and simultaneously formsa part of a flow path of a second fluid other than the first fluid. Thisapparatus joins both the flow paths together thereby mixing and reactingboth the fluids between the processing surfaces 1 and 2. In theembodiment shown in FIG. 4(A), each of the flow paths is hermeticallyclosed and made liquid-tight (when the processed fluid is a liquid) orair-tight (when the processed fluid is a gas).

Specifically, this apparatus as shown in FIG. 4(A) includes the firstprocessing member 10, the second processing member 20, a first holder 11for holding the first processing member 10, a second holder 21 forholding the second processing member 20, a surface-approaching pressureimparting mechanism 4, a rotation drive member, a first introductionpart d1, a second introduction part d2, a fluid pressure impartingmechanism p1, a second fluid supply part p2, and a case 3.

Illustration of the rotation drive member is omitted.

At least one of the first processing member 10 and the second processingmember 20 is able to approach to and separate from each other, and theprocessing surfaces 1 and 2 are able to approach to and separate fromeach other.

In this embodiment, the second processing member 20 approaches to andseparates from the first processing member 10. On the contrary, thefirst processing member 10 may approach to and separate from the secondprocessing member 20, or both the processing members 10 and 20 mayapproach to and separate from each other.

The second processing member 20 is disposed over the first processingmember 10, and the lower surface of the second processing member 20serves as the second processing surface 2, and the upper surface of thefirst processing member 10 serves as the first processing surface 1.

As shown in FIG. 4(A), the first processing member 10 and the secondprocessing member 20 in this embodiment are circular bodies, that is,rings. Hereinafter, the first processing member 10 is referred to as afirst ring 10, and the second processing member 20 as a second ring 20.

Both the rings 10 and 20 in this embodiment are metallic members having,at one end, a mirror-polished surface, respectively, and theirmirror-polished surfaces are referred to as the first processing surface1 and the second processing surface 2, respectively. That is, the uppersurface of the first ring 10 is mirror-polished as the first processingsurface 1, and the lower surface of the second ring is mirror-polishedas the second processing surface 2.

At least one of the holders can rotate relative to the other holder bythe rotation drive member. In FIG. 4(A), numerical 50 indicates a rotaryshaft of the rotation drive member. The rotation drive member may use anelectric motor. By the rotation drive member, the processing surface ofone ring can rotate relative to the processing surface of the otherring.

In this embodiment, the first holder 11 receives drive power on therotary shaft 50 from the rotation drive member and rotates relative tothe second holder 21, whereby the first ring 10 integrated with thefirst holder 10 rotates relative to the second ring 20. Inside the firstring 10, the rotary shaft 50 is disposed in the first holder 11 so as tobe concentric, in a plane, with the center of the circular first ring10.

The first ring 10 rotates centering on the shaft center of the ring 10.The shaft center (not shown) is a virtual line referring to the centralline of the ring 10.

In this embodiment as described above, the first holder 11 holds thefirst ring 10 such that the first processing surface 1 of the first ring10 is directed upward, and the second holder 21 holds the second ring 20such that the second processing surface 2 of the second ring 20 isdirected downward.

Specifically, the first and second holders 11 and 21 include aring-accepting concave part, respectively. In this embodiment, the firstring 11 is fitted in the ring-accepting part of the first holder 11, andthe first ring 10 is fixed in the ring-accepting part so as not to risefrom, and set in, the ring-accepting part of the first holder 11.

That is, the first processing surface 1 is exposed from the first holder11 and faces the second holder 21.

Examples of the material for the first ring 10 include metal, ceramics,sintered metal, abrasion-resistant steel, metal subjected to hardeningtreatment, and rigid materials subjected to lining, coating or plating.The first processing member 10 is preferably formed of a lightweightmaterial for rotation. A material for the second ring 20 may be the sameas that for the first ring 10.

The ring-accepting part 41 arranged in the second holder 21 accepts theprocessing member 2 of the second ring 20 such that the processingmember can rise and set.

The ring-accepting part 41 of the second holder 21 is a concave portionfor mainly accepting that side of the second ring 20 opposite to theprocessing surface 2, and this concave portion is a groove which hasbeen formed into a circle when viewed in a plane.

The ring-accepting part 41 is formed to be larger in size than thesecond ring 20 so as to accept the second ring 20 with sufficientclearance between itself and the second ring 20.

By this clearance, the second ring 20 in the ring-accepting part 41 canbe displaced not only in the axial direction of the circularring-accepting part 41 but also in a direction perpendicular to theaxial direction. In other words, the second ring 20 can, by thisclearance, be displaced relative to the ring-accepting part 41 to makethe central line of the ring 20 unparallel to the axial direction of thering-accepting part 41.

Hereinafter, that portion of the second holder 21 which is surrounded bythe second ring 20 is referred to as a central portion 22.

In other words, the second ring 20 is displaceably accepted within thering-accepting part 41 not only in the thrust direction of thering-accepting part 41, that is, in the direction in which the ring 20rises from and sets in the part 41, but also in the decenteringdirection of the ring 20 from the center of the ring-accepting part 41.Further, the second ring 20 is accepted in the ring-accepting part 41such that the ring 20 can be displaced (i.e. run-out) to vary the widthbetween itself upon rising or setting and the ring-accepting part 41, ateach position in the circumferential direction of the ring 20.

The second ring 20, while maintaining the degree of its move in theabove three directions, that is, the axial direction, decenteringdirection and run-out direction of the second ring 20 relative to thering-accepting part 41, is held on the second holder 21 so as not tofollow the rotation of the first ring 10. For this purpose, suitableunevenness (not shown) for regulating rotation in the circumferentialdirection of the ring-accepting part 41 may be arranged both in thering-accepting part 41 and in the second ring 20. However, theunevenness should not deteriorate displacement in the degree of its movein the three directions.

The surface-approaching pressure imparting mechanism 4 supplies theprocessing members with force exerted in the direction of approachingthe first processing surface 1 and the second processing surface 2 eachother. In this embodiment, the surface-approaching pressure impartingmechanism 4 is disposed in the second holder 21 and biases the secondring 20 toward the first ring 10.

The surface-approaching pressure imparting mechanism 4 uniformly biaseseach position in the circumferential direction of the second ring 20,that is, each position of the processing surface 2, toward the firstring 10. A specific structure of the surface-approaching pressureimparting mechanism 4 will be described later.

As shown in FIG. 4(A), the case 3 is arranged outside the outercircumferential surfaces of both the rings 10 and 20, and accepts aproduct formed between the processing surfaces 1 and 2 and discharged tothe outside of both the rings 10 and 20. As shown in FIG. 4(A), the case3 is a liquid-tight container for accepting the first holder 10 and thesecond holder 20. However, the second holder 20 may be that which as apart of the case, is integrally formed with the case 3.

As described above, the second holder 21 whether formed as a part of thecase 3 or formed separately from the case 3 is not movable so as toinfluence the distance between both the rings 10 and 20, that is, thedistance between the processing surfaces 1 and 2. In other words, thesecond holder 21 does not influence the distance between the processingsurfaces 1 and 2.

The case 3 is provided with an outlet 32 for discharging a product tothe outside of the case 3.

The first introduction part d1 supplies a first fluid to the spacebetween the processing surfaces 1 and 2.

The fluid pressure imparting mechanism p1 is connected directly orindirectly to the first introduction part d1 to impart fluid pressure tothe first processed fluid. A compressor or a pump can be used in thefluid pressure imparting mechanism p1.

In this embodiment, the first introduction part d1 is a fluid patharranged inside the central part 22 of the second holder 21, and one endof the first introduction part d1 is open at the central position of acircle, when viewed in a plane, of the second ring 20 on the secondholder 21. The other end of the first introduction part d1 is connectedto the fluid pressure imparting mechanism p1 outside the second holder20, that is, outside the case 3.

The second introduction part d2 supplies a second fluid to be reactedwith the first fluid to the space between the processing surfaces 1 and2. In this embodiment, the second introduction part is a fluid passagearranged inside the second ring 20, and one end of the secondintroduction part is open at the side of the second processing surface2, and a second fluid-feeding part p2 is connected to the other end.

A compressor or a pump can be used in the second fluid-feeding part p2.

The first processed fluid pressurized with the fluid pressure impartingmechanism p1 is introduced from the first introduction part d1 to thespace between the rings 10 and 20 and will pass through the spacebetween the first processing surface 1 and the second processing surface2 to the outside of the rings 10 and 20.

At this time, the second ring 20 receiving the supply pressure of thefirst fluid stands against the bias of the surface-approaching pressureimparting mechanism 4, thereby receding from the first ring 10 andmaking a minute space between the processing surfaces. The space betweenboth the processing surfaces 1 and 2 by approach and separation of thesurfaces 1 and 2 will be described in detail later.

A second fluid is supplied from the second introduction part d2 to thespace between the processing surfaces 1 and 2, flows into the firstfluid, and is subjected to a reaction promoted by rotation of theprocessing surface. Then, a reaction product formed by the reaction ofboth the fluids is discharged from the space between the processingsurfaces 1 and 2 to the outside of the rings 10 and 20. The reactionproduct discharged to the outside of the rings 10 and 20 is dischargedfinally through the outlet of the case to the outside of the case.

The mixing and reaction of the processed fluid are effected between thefirst processing surface 1 and the second processing surface 2 byrotation, relative to the second processing member 20, of the firstprocessing member 10 with the drive member 5.

Between the first and second processing surfaces 1 and 2, a regiondownstream from an opening m2 of the second introduction part d2 servesas a reaction chamber where the first and second processed fluids arereacted with each other. Specifically, as shown in FIG. 14(C)illustrating a bottom face of the second ring 20, a region H shown byoblique lines, outside the second opening m2 of the second introductionpart in the radial direction r1 of the second ring 20, serves as theprocessing chamber, that is, the reaction chamber. Accordingly, thisreaction chamber is located downstream from the openings m1 and m2 ofthe first introduction part d1 and the second introduction part d2between the processing surfaces 1 and 2.

The first fluid introduced from the first opening m1 through a spaceinside the ring into the space between the processing surfaces 1 and 2,and the second fluid introduced from the second opening m2 into thespace between the processing surfaces 1 and 2, are mixed with each otherin the region H serving as the reaction chamber, and both the processedfluids are reacted with each other. The fluid will, upon receivingsupply pressure from the fluid pressure imparting mechanism p1, movethrough the minute space between the processing surfaces 1 and 2 to theoutside of the rings, but because of rotation of the first ring 10, thefluid mixed in the reaction region H does not move linearly from theinside to the outside of the rings in the radial direction, but movesfrom the inside to the outside of the ring spirally around the rotaryshaft of the ring when the processing surfaces are viewed in a plane. Inthe region H where the fluids are thus mixed and reacted, the fluids canmove spirally from inside to outside to secure a zone necessary forsufficient reaction in the minute space between the processing surfaces1 and 2, thereby promoting their uniform reaction.

The product formed by the reaction becomes a uniform reaction product inthe minute space between the first processing surface 1 and the secondprocessing surface 2 and appears as microparticles particularly in thecase of crystallization or separation.

By the balance among at least the supply pressure applied by the fluidpressure imparting mechanism p1, the bias of the surface-approachingpressure imparting mechanism 4, and the centrifugal force resulting fromrotation of the ring, the distance between the processing surfaces 1 and2 can be balanced to attain a preferable minute space, and further theprocessed fluid receiving the supply pressure applied by the fluidpressure imparting mechanism p1 and the centrifugal force by rotation ofthe ring moves spirally in the minute space between the processingsurfaces 1 and 2, so that their reaction is promoted.

The reaction is forcedly effected by the supply pressure applied by thefluid pressure imparting mechanism p1 and the rotation of the ring. Thatis, the reaction occurs under forced uniform mixing between theprocessing surfaces 1 and 2 arranged opposite to each other so as to beable to approach to and separate from each other, at least one of whichrotates relative to the other.

Accordingly, the crystallization and separation of the product formed bythe reaction can be regulated by relatively easily controllable methodssuch as regulation of supply pressure applied by the fluid pressureimparting mechanism p1 and regulation of the rotating speed of the ring,that is, the number of revolutions of the ring.

As described above, this processing apparatus is excellent in that thespace between the processing surfaces 1 and 2, which can exert influenceon the size of a product, and the distance in which the processed fluidmoves in the reaction region H, which can exert influence on productionof a uniform product, can be regulated by the supply pressure and thecentrifugal force.

The reaction processing gives not only deposit of the product but alsoliquids.

The rotary shaft 50 is not limited to the vertically arranged one andmay be arranged in the horizontal direction or arranged at a slant. Thisis because during processing, the reaction occurs in such a minute spacebetween the processing surfaces 1 and 2 that the influence of gravitycan be substantially eliminated.

In FIG. 4(A), the first introduction part d1 extends vertically andcoincides with the shaft center of the second ring 20 in the secondholder 21. However, the first introduction part d1 is not limited to theone having a center coinciding with the shaft center of the second ring20 and may be arranged in other positions in the central portion 22 ofthe second holder 21 as long as the first fluid can be supplied into thespace surrounded by the rings 10 and 20, and the first introduction partd1 may extend obliquely as well as vertically.

A more preferable embodiment of the apparatus is shown in FIG. 15(A). Asshown in this figure, the second processing member 20 has the secondprocessing surface 2 and a pressure-receiving surface 23 which ispositioned inside, and situated next to, the second processing surface2. Hereinafter, the pressure-receiving surface 23 is also referred to asa separation-regulating surface 23. As shown in the figure, theseparation-regulating surface 23 is an inclined surface.

As described above, the ring-accepting part 41 is formed in the bottom(i.e. a lower part) of the second holder 21, and the second processingmember 20 is accepted in the ring-accepting part 41. The secondprocessing member 20 is held by the second holder 21 so as not to berotated with a baffle (not shown). The second processing surface 2 isexposed from the second holder 21.

In this embodiment, a material to be processed is introduced inside thefirst processing member 10 and the second processing member 20 betweenthe processing surfaces 1 and 2, and the processed material isdischarged to the outside of the first processing member 10 and thesecond processing member 20.

The surface-approaching pressure imparting mechanism 4 presses bypressure the second processing surface 2 against the first processingsurface 1 to make them contacted with or close to each other, andgenerates a fluid film of predetermined thickness by the balance betweenthe surface-approaching pressure and the force, e.g. fluid pressure, ofseparating the processing surfaces 1 and 2 from each other. In otherwords, the distance between the processing surfaces 1 and 2 is kept in apredetermined minute space by the balance between the forces.

Specifically, the surface-approaching pressure imparting mechanism 4 inthis embodiment is comprised of the ring-accepting part 41, aspring-accepting part 42 arranged in the depth of the ring-acceptingpart 41, that is, in the deepest part of the ring-accepting part 41, aspring 43, and an air introduction part 44.

However, the surface-approaching pressure imparting mechanism 4 may bethe one including at least one member selected from the ring-acceptingpart 41, the spring-accepting part 42, the spring 43, and the airintroduction part 44.

The ring-accepting part 41 has the second processing member 20 fit intoit with play to enable the second processing member 20 to be displacedvertically deeply or shallowly, that is, vertically in thering-accepting part 41.

One end of the spring 43 is abutted against the depth of thespring-accepting part 42, and the other end of the spring 43 is abuttedagainst the front (i.e., the upper part) of the second processing member20 in the ring-accepting part 41. In FIG. 1, only one spring 43 isshown, but a plurality of springs 44 are preferably used to pressvarious parts of the second processing member 20. This is because as thenumber of springs 43 increases, pressing pressure can be given moreuniformly to the second processing member 20. Accordingly, several to afew dozen springs 43 comprising a multi-spring type preferably attach tothe second holder 21.

In this embodiment, air can be introduced through the air introductionpart 44 into the ring-accepting part 41. By such introduction of air,air pressure together with pressure by the spring 43 can be given aspressing pressure from the space, as a pressurizing chamber, between thering-accepting part 41 and the second processing member 20 to the secondprocessing member 20. Accordingly, adjusting the pressure of airintroduced through the air introduction part 44 can regulate thesurface-approaching pressure of the second processing surface 2 towardthe first processing surface 1 during operation. A mechanism ofgenerating pressing pressure with another fluid pressure such as oilpressure can be utilized in place of the air introduction part 44utilizing air pressure.

The surface-approaching pressure imparting mechanism 4 not only suppliesand regulates apart of the pressing pressure, that is, thesurface-approaching pressure, but also serves as a displacementregulating mechanism and a buffer mechanism.

Specifically, the surface-approaching pressure imparting mechanism 4 asa displacement regulating mechanism can maintain initial pressingpressure by regulating air pressure against the change in the axialdirection caused by elongation or abrasion at the start of or in theoperation. As described above, the surface-approaching pressureimparting mechanism 4 uses a floating mechanism of maintaining thesecond processing member 20 so as to be displaced, thereby alsofunctioning as a buffer mechanism for micro-vibration or rotationalignment.

Now, the state of the thus constituted processing apparatus during useis described with reference to FIG. 4(A).

At the outset, a first fluid to be processed is pressurized with thefluid pressure imparting mechanism p1 and introduced through the firstintroduction part d1 into the internal space of the sealed case. On theother hand, the first processing member 10 is rotated with the rotationof the rotary shaft 50 by the rotation drive member. The firstprocessing surface 1 and the second processing surface 2 are therebyrotated relatively with a minute space kept therebetween.

The first processed fluid is formed into a fluid film between theprocessing surfaces 1 and 2 with a minute space kept therebetween, and asecond fluid to be processed which is introduced through the secondintroduction part d2 flows into the fluid film between the processingsurfaces 1 and 2 to comprise a part of the fluid film. By this, thefirst and second processed fluids are mixed with each other, and auniform reaction of both of the fluids being reacted with each other ispromoted to form a reaction product. When the reaction is accompanied byseparation, relatively uniform and fine particles can be formed. Evenwhen the reaction is not accompanied by separation, a uniform reactioncan be realized. The separated reaction product may be further finelypulverized by shearing between the first processing surface 1 and thesecond processing surface 2 with the rotation of the first processingsurface 1. The first processing surface 1 and the second processingsurface 2 are regulated to form a minute space of 1 μm to 1 mm,particularly 1 μm to 10 μm, thereby realizing a uniform reaction andenabling production of superfine particles of several nm in diameter.

The product is discharged from the processing surfaces 1 and 2 throughan outlet 33 of the case 3 to the outside of the case. The dischargedproduct is atomized in a vacuum or depressurized atmosphere with awell-known decompression device and converted into liquid in theatmosphere to collide with each other, then what trickled down in theliquid is able to be collected as degassed liquid.

In this embodiment, the processing apparatus is provided with a case,but may be carried out without a case. For example, a decompression tankfor degassing, that is, a vacuum tank, is arranged, and the processingapparatus may be arranged in this tank. In this case, the outletmentioned above is naturally not arranged in the processing apparatus.

As described above, the first processing surface 1 and the secondprocessing surface 2 can be regulated to form a minute space in theorder of μm which cannot be formed by arranging mechanical clearance.Now, this mechanism is described.

The first processing surface 1 and the second processing surface 2 arecapable of approaching to and separating from each other, andsimultaneously rotate relative to each other. In this example, the firstprocessing surface 1 rotates, and the second processing surface 2 slidesin the axial direction thereby approaching to and separating from thefirst processing surface.

In this example, therefore, the position of the second processingsurface 2 in the axial direction is arranged accurately in the order ofμm by the balance between forces, that is, the balance between thesurface-approaching pressure and the separating pressure, therebyestablishing a minute space between the processing surfaces 1 and 2.

As shown in FIG. 15(A), the surface-approaching pressure includes thepressure by air pressure (positive pressure) from the air introductionpart 44 by the surface-approaching pressure imparting mechanism 4, thepressing pressure with the spring 43, and the like.

The embodiments shown in FIG. 13 to FIG. 15 are shown by omitting thesecond introduction part d2 to simplify the drawings. In this respect,these drawings may be assumed to show sections at a position notprovided with the second introduction part d2. In the figures, U and Sshow upward and downward directions respectively.

On the other hand, the separating force include the fluid pressureacting on the pressure-receiving surface at the separating side, thatis, on the second processing surface 2 and the separation regulatingsurface 23, the centrifugal force resulting from rotation of the firstprocessing member 1, and the negative pressure when negative pressure isapplied to the air introduction part 44.

When the apparatus is washed, the negative pressure applied to the airintroduction part 44 can be increased to significantly separate theprocessing surfaces 1 and 2 from each other, thereby facilitatingwashing.

By the balance among these forces, the second processing surface 2 whilebeing remote by a predetermined minute space from the first processingsurface 1 is stabilized, thereby realizing establishment with accuracyin the order of μm.

The separating force is described in more detail.

With respect to fluid pressure, the second processing member 20 in aclosed flow path receives feeding pressure of a processed fluid, thatis, fluid pressure, from the fluid pressure imparting mechanism p. Inthis case, the surfaces opposite to the first processing surface in theflow path, that is, the second processing surface 2 and the separationregulating surface 23, act as pressure-receiving surfaces at theseparating side, and the fluid pressure is applied to thepressure-receiving surfaces to generate a separating force due to thefluid pressure.

With respect to centrifugal force, the first processing member 10 isrotated at high speed, centrifugal force is applied to the fluid, and apart of this centrifugal force acts as separating force in the directionin which the processing surfaces 1 and 2 are separated from each other.

When negative pressure is applied from the air introduction part 44 tothe second processing member 20, the negative pressure acts asseparating force.

In the foregoing description of the present invention, the force ofseparating the first and second processing surfaces 1 and 2 from eachother has been described as a separating force, and the above-mentionedforce is not excluded from the separating force.

By forming a balanced state of the separating force and thesurface-approaching pressure applied by the surface-approaching pressureimparting mechanism 4 via the processed fluid between the processingsurfaces 1 and 2 in the flow path of the closed processed fluid, auniform reaction is realized between the processing surfaces 1 and 2,and simultaneously a fluid film suitable for crystallization andseparation of microscopic reaction products is formed as describedabove. In this manner, this apparatus can form a forced fluid filmbetween the processing surfaces 1 and 2 via which a minute space notachievable with a conventional mechanical apparatus can be kept betweenthe processing surfaces 1 and 2, and microparticles can be formed highlyaccurately as the reaction product.

In other words, the thickness of the fluid film between the processingsurfaces 1 and 2 is regulated as desired by regulating the separatingforce and surface-approaching pressure, thereby realizing a necessaryuniform reaction to form and process microscopic products. Accordingly,when the thickness of the fluid film is to be decreased, thesurface-approaching pressure or separating force may be regulated suchthat the surface-approaching pressure is made relatively higher than theseparating force. When the thickness of the fluid film is to beincreased, the separating force or surface-approaching pressure may beregulated such that the separating force is made relatively higher thanthe surface-approaching pressure.

When the surface-approaching pressure is increased, air pressure, thatis, positive pressure is applied from the air introduction part 44 bythe surface-approaching pressure imparting mechanism 4, or the spring 43is changed to the one having higher pressing pressure, or the number ofsprings may be increased.

When the separating force is to be increased, the feeding pressure ofthe fluid pressure imparting mechanism p1 is increased, or the area ofthe second processing surface 2 or the separation regulating surface 23is increased, or in addition, the rotation of the second processingmember 20 is regulated to increase centrifugal force or reduce pressurefrom the air introduction part 44. Alternatively, negative pressure maybe applied. The spring 43 shown is a pressing spring that generatespressing pressure in an extending direction, but may be a pulling springthat generates a force in a compressing direction to constitute a partor the whole of the surface-approaching pressure imparting mechanism 4.

When the separating force is to be decreased, the feeding pressure ofthe fluid pressure imparting mechanism p1 is reduced, or the area of thesecond processing surface 2 or the separation regulating surface 23 isreduced, or in addition, the rotation of the second processing member 20is regulated to decrease centrifugal force or increase pressure from theair introduction part 44. Alternatively, negative pressure may bereduced.

Further, properties of a processed fluid, such as viscosity, can beadded as a factor for increasing or decreasing the surface-approachingpressure and separating force, and regulation of such properties of aprocessed fluid can be performed as regulation of the above factor.

In the separating force, the fluid pressure exerted on thepressure-receiving surface at the separating side, that is, the secondprocessing surface 2 and the separation regulating surface 23 isunderstood as a force constituting an opening force in mechanical seal.

In the mechanical seal, the second processing member 20 corresponds to acompression ring, and when fluid pressure is applied to the secondprocessing member 20, the force of separating the second processingmember 2 from the first processing member 1 is regarded as openingforce.

More specifically, when the pressure-receiving surfaces at a separatingside, that is, the second processing surface 2 and the separationregulating surface 23 only are arranged in the second processing member20 as shown in the first embodiment, all feeding pressure constitutesthe opening force. When a pressure-receiving surface is also arranged atthe backside of the second processing member 20, specifically in thecase of FIG. 15(B) and FIG. 20 described later, the difference betweenthe feeding pressure acting as a separating force and the feedingpressure acting as surface-approaching pressure is the opening force.

Now, other embodiments of the second processing member 20 are describedwith reference to FIG. 15(B).

As shown in FIG. 15(B), an approach regulating surface 24 facing upward,that is, at the other side of the second processing surface 2, isdisposed at the inner periphery of the second processing member 20exposed from the ring-accepting part 41.

That is, the surface-approaching pressure imparting mechanism 4 in thisembodiment is comprised of a ring-accepting part 41, an air introductionpart 44, and the approach regulating surface 24. However, thesurface-approaching pressure imparting mechanism 4 may be one includingat least one member selected from the ring-accepting part 41, thespring-accepting part 42, the spring 43, the air introduction part 44,and the approach regulating surface 24.

The approach regulating surface 24 receives predetermined pressureapplied to a processed fluid to generate a force of approaching thesecond processing surface 2 to the first processing surface 1, therebyfunctioning in feeding surface-approaching pressure as a part of thesurface-approaching pressure imparting mechanism 4. On the other hand,the second processing surface 2 and the separation regulating surface 23receive predetermined pressure applied to a processed fluid to generatea force of separating the second processing surface 2 from the firstprocessing surface 1, thereby functioning in feeding a part of theseparating force.

The approach regulating surface 24, the second processing surface 2 andthe separation regulating surface 23 are pressure-receiving surfacesreceiving feeding pressure of the processed fluid, and depending on itsdirection, exhibits different actions, that is, generation of thesurface-approaching pressure and generation of a separating force.

The ratio (area ratio A1/A2) of a projected area A1 of the approachregulating surface 24 projected on a virtual plane perpendicular to thedirection of approaching and separating the processing surfaces, thatis, in the direction of rising and setting of the second ring 20, to atotal area A2 of the projected area of the second processing surface 2and the separating side pressure-receiving area 23 of the secondprocessing member 20 projected on the virtual plane is called balanceratio K which is important for regulation of the opening force.

Both the top of the approach regulating surface 24 and the top of theseparating side pressure-receiving surface 23 are defined by the innerperiphery 25 of the circular second regulating part 20, that is, by topline L1. Accordingly, the balance ratio is regulated for deciding theplace where base line L2 of the approach regulating surface 24 is to beplaced.

That is, in this embodiment, when the feeding pressure of the processedfluid is utilized as opening force, the total projected area of thesecond processing surface 2 and the separation regulating surface 23 ismade larger than the projected area of the approach regulating surface24, thereby generating an opening force in accordance with the arearatio.

The opening force can be regulated by the pressure of the processedfluid, that is, the fluid pressure, by changing the balance line, thatis, by changing the area A1 of the approach regulating surface 24.

Sliding surface actual surface pressure P, that is, the fluid pressureout of the surface-approaching pressure, is calculated according to thefollowing equation:

P=P1×(K−k)+Ps

wherein P1 represents the pressure of a processed fluid, that is, fluidpressure; K represents the balance ratio; k represents an opening forcecoefficient; and Ps represents a spring and back pressure.

By regulating this balance line to regulate the sliding surface actualsurface pressure P, the space between the processing surfaces 1 and 2 isformed as a desired minute space, thereby forming a fluid film of aprocessed fluid to make the product minute and effecting uniformreaction processing.

Usually, as the thickness of a fluid film between the processingsurfaces 1 and 2 is decreased, the product can be made finer. On theother hand, as the thickness of the fluid film is increased, processingbecomes rough and the throughput per unit time is increased. Byregulating the sliding surface actual surface pressure P on the slidingsurface, the space between the processing surfaces 1 and 2 can beregulated to realize the desired uniform reaction and to obtain theminute product. Hereinafter, the sliding surface actual surface pressureP is referred to as surface pressure P.

From this relation, it is concluded that when the product is to be madecoarse, the balance ratio may be decreased, the surface pressure P maybe decreased, the space may be increased and the thickness of the filmmay be increased. On the other hand, when the product is to be madefiner, the balance ratio may be increased, the surface pressure P may beincreased, the space may be decreased and the thickness of the film maybe decreased.

As a part of the surface-approaching pressure imparting mechanism 4, theapproach regulating surface 24 is formed, and at the position of thebalance line, the surface-approaching pressure may be regulated, thatis, the space between the processing surfaces may be regulated.

As described above, the space is regulated in consideration of thepressing pressure of the spring 43 and the air pressure of the airintroduction part 44. Regulation of the fluid pressure, that is, thefeeding pressure of the processed fluid, and regulation of the rotationof the first processing member 10 for regulating centrifugal force, thatis, the rotation of the first holder 11, are also important factors toregulate the space.

As described above, this apparatus is constituted such that for thesecond processing member 20 and the first processing member 10 thatrotates relative to the second processing member 20, a predeterminedfluid film is formed between the processing surfaces by pressure balanceamong the feeding pressure of the processed fluid, the rotationcentrifugal force, and the surface-approaching pressure. At least one ofthe rings is formed in a floating structure by which alignment such asrun-out is absorbed to eliminate the risk of abrasion and the like.

The embodiment shown in FIG. 4(A) also applies to the embodiment in FIG.15(B) except that the regulating surface is arranged.

The embodiment shown in FIG. 15(B) can be carried out without arrangingthe pressure-receiving surface 23 on the separating side, as shown inFIG. 20.

When the approach regulating surface 24 is arranged as shown in theembodiment shown in FIG. 15(B) and FIG. 20, the area A1 of the approachregulating surface 24 is made larger than the area A2, whereby all ofthe predetermined pressure exerted on the processed fluid functions assurface-approaching pressure, without generating an opening force. Thisarrangement is also possible, and in this case, both the processingsurfaces 1 and 2 can be balanced by increasing other separating force.

With the area ratio described above, the force acting in the directionof separating the second processing surface 2 from the first processingsurface 1 is fixed as the resultant force exerted by the fluid.

In this embodiment, as described above, the number of springs 43 ispreferably larger in order to impart uniform stress on the slidingsurface, that is, the processing surface. However, the spring 43 may bea single coil-type spring as shown in FIG. 16. As shown in the figure,this spring is a single coil spring having a center concentric with thecircular second processing member 20.

The space between the second processing member 20 and the second holder21 is sealed air-tightly with methods well known in the art.

As shown in FIG. 17, the second holder 21 is provided with a temperatureregulation jacket 46 capable of regulating the temperature of the secondprocessing member 20 by cooling or heating. Numerical 3 in FIG. 14 isthe above-mentioned case, and the case 3 is also provided with a jacket35 for the same purpose of temperature regulation.

The temperature regulation jacket 46 for the second holder 21 is awater-circulating space formed at a side of the ring-accepting part 41and communicates with paths 47 and 48 leading to the outside of thesecond holder 21. One of the paths 47 and 48 introduces a cooling orheating medium into the temperature regulation jacket 46, and the otherdischarges the medium.

The temperature regulation jacket 35 for the case 3 is a path forpassing heating water or cooling water, which is arranged between theouter periphery of the case 3 and a covering part 34 for covering theouter periphery of the case 3.

In this embodiment, the second holder 21 and the case 3 are providedwith the temperature regulation jacket, but the first holder 11 can alsobe provided with such a jacket.

As a part of the surface-approaching pressure imparting mechanism 4, acylinder mechanism 7 shown in FIG. 18 may be arranged besides themembers described above.

The cylinder mechanism 7 includes a cylinder space 70 arranged in thesecond holder 21, a communicating part 71 that communicates the cylinderspace 70 with the ring-accepting part 41, a piston 72 that is acceptedin the cylinder space 70 and connected via the communication part 71 tothe second processing member 20, a first nozzle 73 that communicates tothe upper part of the cylinder space 70, a second nozzle 74 in a lowerpart of the cylinder space 70, and a pressing body 75 such as springbetween the upper part of the cylinder space 70 and the piston 72

The piston 72 can slide vertically in the cylinder space 70, and thesecond processing member 20 can slide vertically with sliding of thepiston 72, to change the gap between the first processing surface 1 andthe second processing surface 2.

Although not shown in the figure, specifically, a pressure source suchas a compressor is connected to the first nozzle 73, and air pressure,that is, positive pressure is applied from the first nozzle 73 to theupper part of the piston 72 in the cylinder space 70, thereby slidingthe piston 72 downward, to allow the second processing member 20 tonarrow the gap between the first and second processing surfaces 1 and 2.Although not shown in the figure, a pressure source such as a compressoris connected to the second nozzle 74, and air pressure, that is,positive pressure is applied from the second nozzle 74 to the lower partof the piston 72 in the cylinder space 70, thereby sliding the piston 72upward, to allow the second processing member 20 to widen the gapbetween the first and second processing surfaces 1 and 2, that is, toenable it to move in the direction of opening the gap. In this manner,the surface-approaching pressure can be regulated by air pressure withthe nozzles 73 and 74.

Even if there is a space between the upper part of the second processingmember 20 in the ring-accepting part 41 and the uppermost part of thering-accepting part 41, the piston 7 is arranged so as to abut againstthe uppermost part 70 a of the cylinder space 70, whereby the uppermostpart 70 a of the cylinder space 70 defines the upper limit of the widthof the gap between the processing surfaces 1 and 2. That is, the piston7 and the uppermost part 70 a of the cylinder space 70 function as aseparation preventing part for preventing the separation of theprocessing surfaces 1 and 2 from each other, in other words, function inregulating the maximum opening of the gap between both the processingsurfaces 1 and 2.

Even if the processing surfaces 1 and 2 do not abut on each other, thepiston 7 is arranged so as to abut against a lowermost part 70 b of thecylinder space 70, whereby the lowermost part 70 b of the cylinder space70 defines the lower limit of the width of the gap between theprocessing surfaces 1 and 2. That is, the piston 7 and the lowermostpart 70 b of the cylinder space 70 function as an approach preventingpart for preventing the approaching of the processing surfaces 1 and 2each other, in other words, function in regulating the minimum openingof the gap between both the processing surfaces 1 and 2.

In this manner, the maximum and minimum openings of the gap areregulated, while a distance z1 between the piston 7 and the uppermostpart 70 a of the cylinder space 70, in other words, a distance z2between the piston 7 and the lowermost part 70 b of the cylinder space70, is regulated with air pressure by the nozzles 73 and 74.

The nozzles 73 and 74 may be connected to a different pressure sourcerespectively, and further may be connected to a single pressure sourcealternatively or switched the connections to the sources.

The pressure source may be a source applying positive or negativepressure. When a negative pressure source such as a vacuum is connectedto the nozzles 73 and 74, the action described above goes to thecontrary.

In place of the other surface-approaching pressure imparting mechanism 4or as a part of the surface-approaching pressure imparting mechanism 4,such cylinder mechanism 7 is provided to set the pressure of thepressure source connected to the nozzle 73 and 74, and the distances z1and z2 according to the viscosity and properties of the fluid to beprocessed in a fashion to bring the thickness value of fluid film of thefluid to a desired level under a shear force to realize a uniformreaction for forming fine particles. Particularly, such cylindermechanism 7 can be used to increase the reliability of cleaning andsterilization by forcing the sliding part open and close during cleaningand steam sterilization.

As shown in FIG. 19(A) to FIG. 19(C), the first processing surface 1 ofthe first processing member 10 may be provided with groove-likedepressions 13 . . . 13 extending in the radial direction, that is, inthe direction from the center to the outside of the first processingmember 10. In this case, as shown in FIG. 19(A), the depressions 13 . .. 13 can be curved or spirally elongated on the first processing surface1, and as shown in FIG. 19(B), he individual depressions 13 may be bentat a right angle, or as shown in FIG. 19(C), the depressions 13 . . . 13may extend straight radially.

As shown in FIG. 19(D), the depressions 13 in FIG. 19(A) to FIG. 19(C)preferably deepen gradually in the direction toward the center of thefirst processing surface 1. The groove-like depressions 13 may continuein sequence or intermittence.

Formation of such depression 13 may correspond to the increase ofdelivery of the processed fluid or to the decrease of calorific value,while having effects of cavitation control and fluid bearing.

In the embodiments shown in FIG. 16, the depressions 13 are formed onthe first processing surface 1, but may be formed on the secondprocessing surface 2 or may be formed on both the first and secondprocessing surfaces 1 and 2.

When the depressions 13 or tapered sections are not provided on theprocessing surface or are arranged unevenly on a part of the processingsurface, the influence exerted by the surface roughness of theprocessing surfaces 1 and 2 on the processed fluid is greater than thatby the above depressions 13. In this case, the surface roughness shouldbe reduced, that is, the surface should be fine-textured, as theparticle size of the processed fluid are to be decreased. Particularly,regarding the surface roughness of the processing surface, the mirrorsurface, that is, a surface subjected to mirror polishing isadvantageous in realizing uniform reaction for the purpose of uniformreaction, and in realizing crystallization and separation of finemonodisperse reaction products for the purpose of obtainingmicroparticles.

In the embodiments shown in FIG. 16 to FIG. 20, structures other thanthose particularly shown are the same as in the embodiments shown inFIG. 4(A) or FIG. 14(C).

In the embodiments described above, the case is closed. Alternatively,the first processing member 10 and the second processing member 20 maybe closed inside but may be open outside. That is, the flow path issealed until the processed fluid has passed through the space betweenthe first processing surface 1 and the second processing surface 2, toallow the processed fluid to receive the feeding pressure, but after thepassing, the flow path may be opened so that the processed fluid afterprocessing does not receive feeding pressure.

The fluid pressure imparting mechanism p1 preferably uses a compressoras a pressure device described above, but if predetermined pressure canalways be applied to the processed fluid, another means may be used. Forexample, the own weight of the processed fluid can be used to applycertain pressure constantly to the processed fluid.

In summary, the processing apparatus in each embodiment described aboveis characterized in that predetermined pressure is applied to a fluid tobe processed, at least two processing surfaces, that is, a firstprocessing surface 1 and a second processing surface 2 capable ofapproaching to and separating from each other are connected to a sealedflow path through which the processed fluid receiving the predeterminedpressure flows, a surface-approaching pressure of approaching theprocessing surfaces 1 and 2 each other is applied to rotate the firstprocessing surface 1 and the second processing surface 2 relative toeach other, thereby allowing a fluid film used for seal in mechanicalseal to be generated out of the processed fluid, and the fluid film isleaked out consciously (without using the fluid film as seal) frombetween the first processing surface 1 and the second processing surface2, contrary to mechanical seal, whereby reaction processing is realizedbetween the processed fluid formed into a film between the surfaces 1and 2, and the product is recovered.

By this epoch-making method, the space between the processing surfaces 1and 2 can be regulated in the range of 1μ to 1 mm, particularly 1μ to10μ.

In the embodiment described above, a flow path for a sealed fluid isconstituted in the apparatus, and the processed fluid is pressurizedwith the fluid pressure imparting mechanism p arranged at the side ofthe introduction part (for the first processing fluid) in the processingapparatus.

Alternatively, the flow path for the processed fluid may be openedwithout pressurization with the fluid pressure imparting mechanism p.

One embodiment of the processing apparatus is shown in FIG. 18 to FIG.20. The processing apparatus illustrated in this embodiment is anapparatus including a degassing mechanism, that is, a mechanism ofremoving a liquid from the formed processed product thereby finallysecuring objective solids (crystals) only.

FIG. 21(A) is a schematic vertical sectional view of the processingapparatus, and FIG. 21(B) is its partially cut enlarged sectional view.FIG. 22 is a plane view of the first processing member 1 arranged in theprocessing apparatus in FIG. 21. FIG. 23 is a partially cut schematicvertical sectional view showing an important part of the first andsecond processing members 1 and 2 in the processing apparatus.

As described above, the apparatus shown in FIG. 21 to FIG. 23 is the oneinto which a fluid as the object of processing, that is, a processedfluid, or a fluid carrying the object of processing, is to be introducedat atmospheric pressure.

In FIG. 21(B) and FIG. 23, the second introduction part d2 is omittedfor simplicity of the drawing (these drawings can be regarded as showinga section at the position where the second introduction part d2 is notarranged).

As shown in FIG. 21(A), this processing apparatus includes a reactionapparatus G and a decompression pump Q. This reaction apparatus Gincludes a first processing member 101 as a rotating member, a firstholder 111 for holding the processing member 101, a second processingmember 102 that is a member fixed to the case, a second holder 121having the second processing member 102 fixed thereto, a bias mechanism103, a dynamical pressure generating mechanism 104 (FIG. 22(A)), a drivepart which rotates the first processing member 101 with the first holder111, a housing 106, a first introduction part d1 which supplies(introduces) a first processed fluid, and a discharge part 108 thatdischarges the fluid to the decompression pump Q. The drive part is notshown.

The first processing member 101 and the second processing member 102 arecylindrical bodies that are hollow in the center. The processing members101 and 102 are members wherein the bottoms of the processing members101 and 102 in a cylindrical form are processing surfaces 110 and 120respectively.

The processing surfaces 110 and 120 have a mirror-polished flat part. Inthis embodiment, the processing surface 120 of the second processingmember 102 is a flat surface subjected as a whole to mirror polishing.The processing surface 110 of the first processing member 101 is a flatsurface as a whole like the second processing member 102, but has aplurality of grooves 112 . . . 112 in the flat surface as shown in FIG.22(A). The grooves 112 . . . 112 while centering on the first processingmember 101 in a cylindrical form extend radially toward the outerperiphery of the cylinder.

The processing surfaces 110 and 120 of the first and second processingmembers 101 and 102 are mirror-polished such that the surface roughnessRa comes to be in the range of 0.01 μm to 1.0 μm. By this mirrorpolishing, Ra is regulated preferably in the range of 0.03 μm to 0.3 μm.

The material for the processing members 101 and 102 is one which isrigid and capable of mirror polishing. The rigidity of the processingmembers 101 and 102 is preferably at least 1500 or more in terms ofVickers hardness. A material having a low linear expansion coefficientor high thermal conductance is preferably used. This is because when thedifference in coefficient of expansion between a part which generatesheat upon processing and other parts is high, distortion is generatedand securement of suitable clearance is influenced.

As the material for the processing members 101 and 102, it is preferableto use particularly SIC, that is, silicon carbide, SIC having a Vickershardness of 2000 to 2500, SIC having a Vickers hardness of 3000 to 4000coated thereon with DLC (diamond-like carbon), WC, that is, tungstencarbide having a Vickers hardness of 1800, WC coated thereon with DLC,and boron ceramics represented by ZrB₂, BTC and B₄C having a Vickershardness of 4000 to 5000.

The housing 106 shown in FIG. 21, the bottom of which is not shownthough, is a cylinder with a bottom, and the upper part thereof iscovered with the second holder 121. The second holder 121 has the secondprocessing member 102 fixed to the lower surface thereof, and theintroduction part d1 is arranged in the upper part thereof. Theintroduction part d1 is provided with a hopper 170 for introducing afluid or a processed material from the outside.

Although not shown in the figure, the drive part includes a power sourcesuch as a motor and a shaft 50 that rotates by receiving power from thepower source.

As shown in FIG. 21(A), the shaft 50 is arranged in the housing 106 andextends vertically. Then, the first holder 111 is arranged on the top ofthe shaft 50. The first holder 111 is to hold the first processingmember 101 and is arranged on the shaft 50 as described above, therebyallowing the processing surface 110 of the first processing member 101to correspond to the processing surface 120 of the second processingmember 102.

The first holder 111 is a cylindrical body, and the first processingmember 101 is fixed on the center of the upper surface. The firstprocessing member 101 is fixed so as to be integrated with the firstholder 111, and does not change its position relative to the firstholder 111.

On the other hand, a receiving depression 124 for receiving the secondprocessing member 102 is formed on the center of the upper surface ofthe second holder 121.

The receiving depression 124 has a circular cross-section. The secondprocessing member 102 is accepted in the cylindrical receivingdepression 124 so as to be concentric with the receiving depression 124.

The structure of the receiving depression 124 is similar to that in theembodiment as shown in FIG. 4(A) (the first processing member 101corresponds to the first ring 10, the first holder 111 to the firstholder 11, the second processing member 102 to the second ring 20, andthe second holder 121 to the second holder 21).

Then, the second holder 121 is provided with the bias mechanism 103. Thebias mechanism 103 preferably uses an elastic body such as spring. Thebias mechanism 103 corresponds to the surface-approaching pressureimparting mechanism 4 in FIG. 4(A) and has the same structure. That is,the bias mechanism 103 presses that side (bottom) of the secondprocessing member 102 which is opposite to the processing surface 120and biases each position of the second processing member 102 uniformlydownward to the first processing member 101.

On the other hand, the inner diameter of the receiving depression 124 ismade larger than the outer diameter of the second processing member 102,so that when arranged concentrically as described above, a gap t1 isarranged between outer periphery 102 b of the second processing member102 and inner periphery of the receiving depression 124, as shown inFIG. 21(B).

Similarly, a gap t2 is arranged between inner periphery 102 a of thesecond processing member 102 and outer periphery of the central part 22of the receiving depression 124, as shown in FIG. 21(B).

The gaps t1 and t2 are those for absorbing vibration and eccentricbehavior and are set to be in a size to secure operational dimensions ormore and to enable sealing. For example, when the diameter of the firstprocessing member 101 is 100 mm to 400 mm, the gaps t1 and t2 arepreferably 0.05 mm to 0.3 mm, respectively.

The first holder 111 is fixed integrally with the shaft 50 and rotatedwith the shaft 50. The second processing member 102 is not rotatedrelative to the second holder 121 by a baffle (not shown). However, forsecuring 0.1 micron to 10 micron clearance necessary for processing,that is, the minute gap t between the processing surfaces 110 and 120 asshown in FIG. 23(B), a gap t3 is arranged between the bottom of thereceiving depression 124, that is, the top part, and the surface facinga top part 124 a of the second processing member 102, that is, the upperpart. The gap t3 is established in consideration of the clearance andthe vibration and elongation of the shaft 50.

As described above, by the provision of the gaps t1 to t3, the firstprocessing member 101 can move not only in the direction of approachingto and separating from the second processing member 102, but alsorelative to the center and direction of the processing surface 110, thatis, relative to the directions z1 and z2.

That is, in this embodiment, the bias mechanism 103 and the gaps t1 tot3 constitute a floating mechanism, and by this floating mechanism, thecenter and inclination of at least the second processing member 102 aremade variable in the small range of several μm to several mm. Therun-out and expansion of the rotary shaft and the surface vibration andvibration of the first processing member 101 are absorbed.

The groove 112 on the polishing surface 110 of the first processingmember 101 is described in more detail. The rear end of the groove 112reaches the inner periphery 101 a of the first processing member 101,and its top is elongated toward the outside y of the first processingmember 101, that is, toward the outer periphery. As shown in FIG. 22(A),the sectional area of the groove 112 is gradually decreased in thedirection from the center x of the circular first processing member 101to the outside y of the first processing member 101, that is, toward theouter periphery.

The distance w1 of the left and right sides 112 a and 112 b of thegroove 112 is decreased in the direction from the center x of the firstprocessing member 101 to the outside y of the first processing member101, that is, toward the outer periphery. As shown in FIG. 22(B), thedepth w2 of the groove 112 is decreased in the direction from the centerx of the first processing member 101 to the outside y of the firstprocessing member 101, that is, toward the outer periphery. That is, thebottom 112 c of the groove 112 is decreased in depth in the directionfrom the center x of the first processing member 101 to the outside y ofthe first processing member 101, that is, toward the outer periphery.

As described above, the groove 112 is gradually decreased both in widthand depth toward the outside y, that is, toward the outer periphery, andits sectional area is gradually decreased toward the outside y. Then,the top of the groove 112, that is, the y side, is a dead end. That is,the top of the groove 112, that is, the y side does not reach the outerperiphery 101 b of the first processing member 101, and an outer flatsurface 113 is interposed between the top of the groove 112 and theouter periphery 101 b. The outer flat surface 113 is a part of theprocessing surface 110.

In the embodiment shown in FIG. 22, the left and right sides 112 a and112 b and the bottom 112 c of the groove 112 constitute a flow pathlimiting part. This flow path limiting part, the flat part around thegroove 112 of the first processing member 101, and the flat part of thesecond processing member 102 constitute the dynamical pressuregenerating mechanism 104.

However, only one of the width and depth of the groove 112 may beconstituted as described above to decrease the sectional area.

While the first processing member 101 rotates, the dynamical pressuregenerating mechanism 104 generates a force in the direction ofseparating the processing members 101 and 102 from each other to securea desired minute space between the processing members 101 and 102 by afluid passing through the space between the processing members 101 and102. By generation of such dynamical pressure, a 0.1 μm to 10 μm minutespace can be generated between the processing surfaces 110 and 120. Aminute space like that can be regulated and selected depending on theobject of processing, but is preferably 1 to 6 μm, more preferably 1 μmto 2 μm. This apparatus can realize a uniform reaction and formmicroparticles by the minute space, which are not achieved in the priorart.

The grooves 112 . . . 112 may extend straight from the center x to theoutside y. In this embodiment, however, as shown in FIG. 22(A), thegrooves 112 are curved to extend such that with respect to a rotationdirection r of the first processing member 101, the center x of thegroove 112 is positioned in front of the outside y of the groove 112.

In this manner, the grooves 112 . . . 112 are curved to extend so thatthe separation force by the dynamical pressure generating mechanism 104can be effectively generated.

Then, the working of this apparatus is described.

A first processed fluid R which has been introduced from a hopper 17 andhas passed through the first introduction part d1, passes through thehollow part of the circular second processing member 102, and the fluidthat has received the centrifugal force resulting from rotation of thefirst processing member 101 enters the space between the processingmembers 101 and 102, and uniform reaction and generation ofmicroparticles are effected and processed between the processing surface110 of the rotating first processing member 101 and the processingsurface 120 of the second processing member 102, then exits from theprocessing members 101 and 102 and is then discharged from the dischargepart 108 to the side of the decompression pump Q. Hereinafter, the firstprocessed fluid R is referred to simply as a fluid R, if necessary.

In the foregoing description, the fluid R that has entered the hollowpart of the circular second processing member 102 first enters thegroove 112 of the rotating first processing member 101 as shown in FIG.23(A). On the other hand, the processing surfaces 110 and 120 that aremirror-polished flat parts are kept airtight even by passing a gas suchas air or nitrogen. Accordingly, even if the centrifugal force byrotation is received, the fluid cannot enter through the groove 112 intothe space between the processing surfaces 110 and 120 that are pushedagainst each other by the bias mechanism 103. However, the fluid Rgradually runs against both the sides 112 a and 112 b and the bottom 112c of the groove 112 formed as a flow path limiting part to generatedynamical pressure acting in the direction of separating the processingsurfaces 110 and 120 from each other. As shown in FIG. 23(B), the fluidR can thereby exude from the groove 112 to the flat surface, to secure aminute gap t, that is, clearance, between the processing surfaces 110and 120. Then, a uniform reaction and generation of microparticles areeffected and processed between the mirror-polished flat surfaces. Thegroove 112 has been curved so that the centrifugal force is applied moreaccurately to the fluid to make generation of dynamical pressure moreeffectively.

In this manner, the processing apparatus can secure a minute and uniformgap, that is, clearance, between the mirror surfaces, that is, theprocessing surfaces 110 and 120, by the balance between the dynamicalpressure and the bias force by the bias mechanism 103. By the structuredescribed above, the minute gap can be as superfine as 1 μm or less.

By utilizing the floating mechanism, the automatic regulation ofalignment between the processing surfaces 110 and 120 becomes possible,and the clearance in each position between the processing surfaces 110and 120 can be prevented from varying against physical deformation ofeach part by rotation or generated heat, and the minute gap in eachposition can be maintained.

In the embodiment described above, the floating mechanism is a mechanismarranged for the second holder 121 only. Alternatively, the floatingmechanism can be arranged in the first holder 111 instead of, ortogether with, the second holder 121.

Other embodiments of the groove 112 are shown in FIG. 24 to FIG. 26.

As shown in FIG. 24(A) and FIG. 24(B), the groove 112 can be provided atthe top with a flat wall surface 112 d as a part of the flow pathlimiting part. In the embodiment shown in FIG. 14, a step 112 e isarranged between the first wall surface 112 d and the inner periphery101 a in the bottom 112 c, and the step 112 e also constitutes a part ofthe flow path limiting part.

As shown in FIG. 25(A) and FIG. 25(B), the groove 112 includes aplurality of branches 112 f . . . 112 f, and each branch 112 f narrowsits width thereby being provided with a flow path limiting part.

With respect to the embodiments in FIG. 17 and FIG. 18, structures otherthan those particularly shown are similar to those of embodiments asshown in FIG. 4(A), FIG. 14(C), and FIG. 21 to FIG. 23.

In the embodiments described above, at least either the width or depthof the groove 112 is gradually decreased in size in the direction frominside to outside the first processing member 101, thereby constitutinga flow path limiting part. Alternatively, as shown in FIG. 26(A) or FIG.26(B), t the groove 112 can be provided with a termination surface 112 fwithout changing the width and depth of the groove 112, and thetermination surface 112 f of the groove 112 can serve as a flow pathlimiting part. As shown the embodiments in FIG. 22, FIG. 24 and FIG. 25,the width and depth of the groove 112 can be changed as described abovethereby slanting the bottom and both sides of the groove 112, so thatthe slanted surfaces serves as a pressure-receiving part toward thefluid to generate dynamical pressure. In the embodiment shown in FIG.26(A) and FIG. 26(B), on the other hand, the termination surface of thegroove 112 serves as a pressure-receiving part toward the fluid togenerate dynamical pressure.

In the embodiment shown in FIG. 26(A) and FIG. 26(B), at least one ofthe width and depth of the groove 112 may also be gradually decreased insize.

The structure of the groove 112 is not limited to the one shown in FIG.22 and FIG. 24 to FIG. 26 and can be provided with a flow path limitingpart having other shapes.

For example, in the embodiments shown in FIG. 22 and FIG. 24 to FIG. 26,the groove 112 does not penetrate to the outer side of the firstprocessing member 101. That is, there is an outer flat surface 113between the outer periphery of the first processing member 101 and thegroove 112. However, the structure of the groove 112 is not limited tosuch embodiment, and the groove 112 may reach the outer periphery of thefirst processing member 101 as long as the dynamical pressure can begenerated.

For example, in the case of the first processing member 101 shown inFIG. 26(B), as shown in the dotted line, a part having a smallersectional area than other sites of the groove 112 can be formed on theouter flat surface 113.

The groove 112 may be formed so as to be gradually decreased in size inthe direction from inside to outside as described above, and the part(terminal) of the groove 112 that had reached the outer periphery of thefirst processing member 101 may have the minimum sectional area (notshown). However, the groove 112 preferably does not penetrate to theouter periphery of the first processing member 101 as shown in FIG. 22and FIG. 24 to FIG. 26, in order to effectively generate dynamicalpressure.

Now, the embodiments shown in FIG. 21 to FIG. 26 are summarized.

This processing apparatus is a processing apparatus wherein a rotatingmember having a flat processing surface and a fixed member having a flatprocessing surface are opposite to each other so as to be concentricwith each other, and while the rotating member is rotated, a material tobe reacted is fed through an opening of the fixed member and subjectedto a reaction between the opposite flat processing surfaces of bothmembers, wherein the rotating member is provided with a pressurizingmechanism by which pressure is generated to maintain clearance withoutmechanically regulating clearance and enables 1 μm to 6 μm microscopicclearance not attainable by mechanical regulation of clearance, therebysignificantly improving an ability to pulverize formed particles and anability to uniformize the reaction.

That is, this processing apparatus have a rotating member and a fixedmember each having a flat processing surface in the outer peripherythereof and has a sealing mechanism in a plane on the flat processingsurface, thereby providing a high speed rotation processing apparatusgenerating hydrostatic force, hydrodynamic force, oraerostatic-aerodynamic force. The force generates a minute space betweenthe sealed surfaces, and provides a reaction processing apparatus with afunction of non-contact and mechanically safe and high-levelpulvelization and uniformizing of reactions. One factor for forming thisminute space is due to the rotation speed of the rotating member, andthe other factor is due to a pressure difference between theintroduction side and discharge side of a processed material (fluid).When a pressure imparting mechanism is arranged in the introductionside, when a pressure imparting mechanism is not arranged in theintroduction side, that is, when the processed material (fluid) isintroduced at atmospheric pressure, there is no pressure difference, andthus the sealed surfaces should be separated by only the rotation speedof the rotating member. This is known as hydrodynamic or aerodynamicforce.

FIG. 21(A) shows the apparatus wherein a decompression pump Q isconnected to the discharge part of the reaction apparatus G, but asdescribed above, the reaction apparatus G may be arranged in adecompression tank T without arranging the housing 106 and thedecomposition pump Q, as shown in FIG. 27(A).

In this case, the tank T is decompressed in a vacuum or in an almostvacuum, whereby the processed product formed in the reaction apparatus Gis sprayed in a mist form in the tank T, and the processed materialcolliding with, and running down along, the inner wall of the tank T canbe recovered, or a gas (vapor) separated from the processed material andfilled in an upper part of the tank T, unlike the processed materialrunning down along the wall, can be recovered to obtain the objectiveproduct after processing.

As shown in FIG. 27(B), when the decompression pump Q is used, anairtight tank T is connected via the decompression pump Q to theprocessing apparatus G, whereby the processed material after processingcan be formed into mist to separate and extract the objective product.

As shown in FIG. 27(C), the decompression pump Q is connected directlyto the processing apparatus G, and the decompression pump Q and adischarge part for fluid R, different from the decompression pump Q, areconnected to the tank T, whereby the objective product can be separated.In this case, a gasified portion is sucked by the decompression pump Q,while the fluid R (liquid portion) is discharged from the discharge partseparately from the gasified portion.

In the embodiments described above, the first and second processedfluids are introduced via the second holders 21 and 121 and the secondrings 20 and 102 respectively and mixed and reacted with each other.

Now, other embodiments with respect to introduction of fluids to beprocessed into the apparatus are described.

As shown in FIG. 4(B), the processing apparatus shown in FIG. 4(A) isprovided with a third introduction part d3 to introduce a third fluid tobe processed into the space between the processing surfaces 1 and 2, andthe third fluid is mixed and reacted with the first processed fluid aswell as the second processed fluid.

By the third introduction part d3, the third fluid to be mixed with thefirst processed fluid is fed to the space between the processingsurfaces 1 and 2. In this embodiment, the third introduction part d3 isa fluid flow path arranged in the second ring 20 and is open at one endto the second processing surface 2 and has a third fluid feed part p3connected to the other end.

In the third fluid feed part p3, a compressor or another pump can beused.

The opening of the third introduction part d3 in the second processingsurface 2 is positioned outside, and more far from, the rotation centerof the first processing surface 1 than the opening of the secondintroduction part d2. That is, in the second processing surface 2, theopening of the third introduction part d3 is located downstream from theopening of the second introduction part d2. A gap is arranged betweenthe opening of the third introduction d3 and the opening of the secondintroduction part d2 in the radial direction of the second ring 20.

With respect to structures other than the third introduction d3, theapparatus shown in FIG. 4(B) is similar to that in the embodiment as inFIG. 4(A). In FIG. 4(B) and further in FIG. 4(C), FIG. 4(D) and FIG. 5to FIG. 14 described later, the case 3 is omitted to simplify thedrawings. In FIG. 12(B), FIG. 12(C), FIG. 13, FIG. 14(A) and FIG. 14(B),a part of the case 3 is shown.

As shown in FIG. 4(C), the processing apparatus shown in FIG. 4(B) isprovided with a fourth introduction part d4 to introduce a fourth fluidto be processed into the space between the processing surfaces 1 and 2,and the fourth fluid is mixed and reacted with the first processed fluidas well as the second and third processed fluids.

By the fourth introduction part d4, the fourth fluid to be mixed withthe first processed fluid is fed to the space between the processingsurfaces 1 and 2. In this embodiment, the fourth introduction part d4 isa fluid flow path arranged in the second ring 20, is open at one end tothe second processing surface 2, and has a fourth fluid feed part p4connected to the other end.

In the fourth fluid feed part p4, a compressor or another pump can beused.

The opening of the fourth introduction part d4 in the second processingsurface 2 is positioned outside, and more far from, the rotation centerof the first processing surface 1 than the opening of the thirdintroduction part d3. That is, in the second processing surface 2, theopening of the fourth introduction part d4 is located downstream fromthe opening of the third introduction part d3.

With respect to structures other than the fourth introduction part d4,the apparatus shown in FIG. 4(C) is similar to that in the embodiment asin FIG. 4(B).

Five or more introduction parts further including a fifth introductionpart, a sixth introduction part and the like can be arranged to mix andreact five or more fluids to be processed with one another (not shown).

As shown in FIG. 4(D), the first introduction part d1 arranged in thesecond holder 21 in the apparatus in FIG. 4(A) can, similar to thesecond introduction part d2, be arranged in the second processingsurface 2 in place of the second holder 21. In this case, the opening ofthe first introduction part d1 is located at the upstream side from thesecond introduction part d2, that is, it is positioned nearer to therotation center than the second introduction part d2 in the secondprocessing surface 2.

In the apparatus shown in FIG. 4(D), the opening of the secondintroduction part d2 and the opening of the third introduction part d3both are arranged in the second processing surface 2 of the second ring20. However, arrangement of the opening of the introduction part is notlimited to such arrangement relative to the processing surface.Particularly as shown in FIG. 5(A), the opening of the secondintroduction part d2 can be arranged in a position adjacent to thesecond processing surface 2 in the inner periphery of the second ring20. In the apparatus shown in FIG. 5(A), the opening of the thirdintroduction part d3 is arranged in the second processing surface 2similarly to the apparatus shown in FIG. 4(B), but the opening of thesecond introduction part d2 can be arranged inside the second processingsurface 2 and adjacent to the second processing surface 2, whereby thesecond processed fluid can be immediately introduced onto the processingsurfaces.

In this manner, the opening of the first introduction part d1 isarranged in the second holder 21, and the opening of the secondintroduction part d2 is arranged inside the second processing surface 2and adjacent to the second processing surface 2 (in this case,arrangement of the third introduction part d3 is not essential), so thatparticularly in reaction of a plurality of processed fluids, theprocessed fluid introduced from the first introduction part d1 and theprocessed fluid introduced from the second introduction part d2 areintroduced, without being reacted with each other, into the spacebetween the processing surfaces 1 and 2, and then both the fluids can bereacted first between the processing surfaces 1 and 2. Accordingly, thestructure described above is suitable for obtaining a particularlyreactive processed fluid.

The term “adjacent” is not limited to the arrangement where the openingof the second introduction part d2 is contacted with the inner side ofthe second ring 20 as shown in FIG. 5(A). The distance between thesecond ring 20 and the opening of the second introduction part d2 may besuch a degree that a plurality of processed fluids are not completelymixed and reacted with one another prior to introduction into the spacebetween the processing surfaces 1 and 2. For example, the opening of thesecond introduction part d2 may be arranged in a position near thesecond ring 20 of the second holder 21. Alternatively, the opening ofthe second introduction part d2 may be arranged on the side of the firstring 10 or the first holder 11.

In the apparatus shown in FIG. 4(B), a gap is arranged between theopening of the third introduction part d3 and the opening of the secondintroduction part d2 in the radial direction of the second ring 20, butas shown in FIG. 5(A), the second and third processed fluids can beintroduced into the space between the processing surfaces 1 and 2,without providing such gap, thereby immediately joining both the fluidstogether. The apparatus shown in FIG. 5(A) can be selected depending onthe object of processing.

In the apparatus shown in FIG. 4(D), a gap is also arranged between theopening of the first introduction part d1 and the opening of the secondintroduction part d2 in the radial direction of the second ring 20, butthe first and second processed fluids can be introduced into the spacebetween the processing surfaces 1 and 2, without providing such gap,thereby immediately joining both the fluids together. Such arrangementof the opening can be selected depending on the object of processing.

In the embodiment shown in FIG. 4(B) and FIG. 4(C), the opening of thethird introduction part d3 is arranged in the second processing surface2 downstream from the opening of the second introduction part d2, inother words, outside the opening of the second introduction part d2 inthe radial direction of the second ring 20. Alternatively, as shown inFIG. 5(C) and FIG. 6(A), the opening of the third introduction part d3and the opening of the second introduction part d2 can be arranged inthe second processing surface 2 in positions different in acircumferential direction r0 of the second ring 20. In FIG. 6, numeralm1 is the opening (first opening) of the first introduction part d1,numeral m2 is the opening (second opening) of the second introductionpart d2, numeral m3 is the opening (third opening) of the thirdintroduction part d3, and numeral r1 is the radical direction of thering.

When the first introduction part d1 is arranged in the second ring 20,as shown in FIG. 5(D), the opening of the first introduction part d1 andthe opening of the second introduction part d2 can be arranged in thesecond processing surface 2 in positions different in thecircumferential direction of the second ring 20.

In the apparatus shown in FIG. 5(B), the openings of two introductionparts are arranged in the second processing surface 2 of the second ring20 in positions different in the circumferential direction r0, but asshown in FIG. 6(B), the openings of three introduction parts can bearranged in positions different in the circumferential direction r0 ofthe ring, or as shown in FIG. 6(C), the openings of four introductionparts can be arranged in positions different in the circumferentialdirection r0 of the ring. In FIG. 6(B) and FIG. 6(C), numeral m4 is theopening of the fourth introduction part, and in FIG. 6(C), numeral m5 isthe opening of the fifth introduction part. Five or more openings ofintroduction parts may be arranged in positions different in thecircumferential direction r0 of the ring (not shown).

In the apparatuses shown in FIG. 5(B) and FIG. 5(D) and in FIG. 6(A) toFIG. 6(C), the second to fifth introduction parts can introducedifferent fluids, that is, the second, third, fourth and fifth fluids.On the other hand, the second to fifth openings m2 to m5 can introducethe same fluid, that is, the second fluid into the space between theprocessing surfaces. In this case, the second to fifth introductionparts are connected to the inside of the ring and can be connected toone fluid feed part, that is, the second fluid feed part p2 (not shown).

A plurality of openings of introduction parts arranged in positionsdifferent in the circumferential direction r0 of the ring can becombined with a plurality of openings of introduction parts arranged inpositions different in the radial direction r1 of the ring.

For example, as shown in FIG. 6(D), the openings m2 to m9 of eightintroduction parts are arranged in the second processing surface 2,wherein four openings m2 to m5 of them are arranged in positionsdifferent in the circumferential direction r0 of the ring and identicalin the radial direction r1 of the ring, and the other four openings m5to m8 are arranged in positions different in the circumferentialdirection r0 of the ring and identical in the radial direction r1 of thering. Then, the other openings m5 to m8 are arranged outside the radialdirection r of the four openings m2 to m5. The outside openings andinside openings may be arranged in positions identical in thecircumferential direction r0 of the ring, but in consideration ofrotation of the ring, may be arranged in positions different in thecircumferential direction r0 of the ring as shown in FIG. 6(D). In thiscase too, the openings are not limited to arrangement and number shownin FIG. 6(D).

For example, as shown in FIG. 6(E), the outside opening in the radialdirection can be arranged in the apex of a polygon, that is, in the apexof a rectangle in this case, and the inside opening in the radialdirection can be positioned on one side of the rectangle. As a matter ofcourse, other arrangements can also be used.

When the openings other than the first opening m1 feed the secondprocessed fluid into the space between the processing surfaces, each ofthe openings may be arranged as continuous openings in thecircumferential direction r0 as shown in FIG. 6(F), instead of beingarranged discretely in the circumferential direction r0 of theprocessing surface.

As shown in FIG. 7(A), depending on the object of processing, the secondintroduction part d2 arranged in the second ring 20 in the apparatusshown in FIG. 7(A) can be, similar to the first introduction part d1,arranged in the central portion 22 of the second holder 21. In thiscase, the opening of the second introduction part d2 is positioned witha gap outside the opening of the first introduction part d1 positionedin the center of the second ring 20. As shown in FIG. 7(B), in theapparatus shown in FIG. 7(A), the third introduction part d3 can bearranged in the second ring 20. As shown in FIG. 7(C), in the apparatusshown in FIG. 6(A), the second and third processed fluids can beintroduced into the space inside the second ring 20 without arranging agap between the opening of the first introduction part d1 and theopening of the second introduction part d2, so that both the fluids canimmediately join together. As shown in FIG. 7(D), depending on theobject of processing, in the apparatus shown in FIG. 6(A), the thirdintroduction part d3 can be, similar to the second introduction part d2,arranged in the second holder 21. Four or more introduction parts may bearranged in the second holder 21 (not shown).

As shown in FIG. 8(A), depending on the object of processing, in theapparatus shown in FIG. 7(D), the fourth introduction part d4 can bearranged in the second ring 20, so that the fourth processed fluid maybe introduced into the space between the processing surfaces 1 and 2.

As shown in FIG. 8(B), in the apparatus shown in FIG. 4(A), the secondintroduction part d2 can be arranged in the first ring 10, and theopening of the second introduction part d2 can be arranged in the firstprocessing surface 1.

As shown in FIG. 8(C), in the apparatus shown in FIG. 8(B), the thirdintroduction part d3 can be arranged in the first ring 10, and theopening of the third introduction part d3 and the opening of the secondintroduction part d2 can be arranged in the first processing surface 1in positions different in the circumferential direction of the firstring 10.

As shown in FIG. 8(D), in the apparatus shown in FIG. 8(B), the firstintroduction part d1 can be arranged in the second ring 20 instead ofarranging the first introduction part d1 in the second holder 21, andthe opening of the first introduction part d1 can be arranged in thesecond processing surface 2. In this case, the openings of the first andsecond introduction parts d1 and d2 are arranged in positions identicalin the radial direction of the ring.

As shown in FIG. 9(A), in the apparatus shown in FIG. 4(A), the thirdintroduction part d3 can be arranged in the first ring 10, and theopening of the third introduction part d3 can be arranged in the firstprocessing surface 1. In this case, both the openings of the second andthird introduction parts d2 and d3 are arranged in positions identicalin the radial direction of the ring. However, both the openings may bearranged in positions different in the radial direction of the ring.

In the apparatus shown in FIG. 8(C), the openings are arranged inpositions identical in the radial direction of the first ring 10 andsimultaneously arranged in positions different in the circumferentialdirection (that is, rotation direction) of the first ring 10, but inthis apparatus, as shown in FIG. 9(B), both the openings of the secondand third introduction parts d2 and d3 can be arranged in positionsdifferent in the radical direction of the first ring 10. In this case,as shown 9(B), a gap can be arranged between both the openings of thesecond and third introduction parts d2 and d3 in the radial direction ofthe first ring 10, or without arranging the gap, the second and thirdprocessed fluids may immediately join together (not shown).

As shown in FIG. 9(C), the first introduction part d1 together with thesecond introduction part d2 can be arranged in the first ring 10 insteadof arranging the first introduction part d1 in the second holder 21. Inthis case, in the first processing surface 1, the opening of the firstintroduction part d1 is arranged upstream (inside the radial directionof the first ring 11) from the opening of the second introduction partd2. A gap is arranged between the opening of the first introduction partd1 and the opening of the second introduction part d2 in the radialdirection of the first ring 11. Alternatively, such gap may not bearranged (not shown).

As shown in FIG. 9(D), both the openings of the first introduction partd1 and the second introduction part d2 can be arranged in positionsdifferent in the circumferential direction of the first ring 10 in thefirst processing surface 1 in the apparatus shown in FIG. 9(C).

In the embodiment shown in FIG. 9(C) and FIG. 9(D), three or moreintroduction parts may be arranged in the first ring 10, and in thesecond processing surface 2, so the respective openings may be arrangedin positions different in the circumferential direction or in positionsdifferent in the radial direction of the ring (not shown). For example,the arrangement of openings in the second processing surface 2, shown inFIG. 6(B) to FIG. 6(F), can also be used in the first processing surface1.

As shown in FIG. 10(A), in the apparatus shown in FIG. 4(A), the secondintroduction part d2 can be arranged in the first holder 11 instead ofarranging the part d2 in the second ring 20. In this case, the openingof the second introduction part d2 is arranged preferably in the centerof the central shaft of rotation of the first ring 10, in the sitesurrounded with the first ring 10 on the upper surface of the firstholder 11.

As shown in FIG. 10(B), in the embodiment shown in FIG. 10(A), the thirdintroduction part d3 can be arranged in the second ring 20, and theopening of the third introduction part d3 can be arranged in the secondprocessing surface 2.

As shown in FIG. 10(C), the first introduction part d1 can be arrangedin the first holder 11 instead of arranging the part d1 in the secondholder 21. In this case, the opening of the first introduction part d1is arranged preferably in the central shaft of rotation of the firstring 10, in the site surrounded with the first ring 10 on the uppersurface of the first holder 11. In this case, as shown in the figure,the second introduction part d2 can be arranged in the first ring 10,and its opening can be arranged in the first processing surface 1. Inthis case, the second introduction part d2 can be arranged in the secondring 20, and its opening can be arranged in the second processingsurface 2 (not shown).

As shown in FIG. 10(D), the second introduction part d2 shown in FIG.10(C) together with the first introduction part d1 can be arranged inthe first holder 11. In this case, the opening of the secondintroduction part d2 is arranged in the site surrounded with the firstring 10 on the upper surface of the first holder 11. In this case, thesecond introduction part d2 arranged in the second ring 20 may serve asthe third introduction part d3 in FIG. 10(C).

In the embodiments shown in FIG. 4 to FIG. 10, the first holder 11 andthe first ring 10 are rotated relative to the second holder 21 and thesecond ring 20, respectively. As shown in FIG. 11(A), in the apparatusshown in FIG. 4(A), the second holder 2 may be provided with a rotaryshaft 51 rotating with the turning force from the rotation drive member,to rotate the second holder 21 in a direction opposite to the firstholder 11. The rotation drive member may be arranged separately from theone for rotating the rotary shaft 50 of the first holder 11 or mayreceive power from the drive part for rotating the rotary shaft 50 ofthe first holder 11 by a power transmission means such as a gear. Inthis case, the second holder 2 is formed separately from the case, andshall, like the first holder 11, be rotatably accepted in the case.

As shown in FIG. 11(B), in the apparatus shown in FIG. 11(A), the secondintroduction part d2 can be, similarly in the apparatus in FIG. 10(B),arranged in the first holder 11 in place of the second ring 20.

In the apparatus shown in FIG. 11(B), the second introduction part d2can be arranged in the second holder 21 in place of the first holder 11(not shown). In this case, the second introduction part d2 is the sameas one in the apparatus in FIG. 10(A). As shown in FIG. 11(C), in theapparatus shown in FIG. 11(B), the third introduction part d3 can bearranged in the second ring 20, and the opening of the thirdintroduction part d3 can be arranged in the second processing surface 2.

As shown in FIG. 11(D), the second holder 21 only can be rotated withoutrotating the first holder 11. Even in the apparatuses shown in FIG. 4(B)to FIG. 10, the second holder 21 together with the first holder 11, orthe second holder 21 alone, can be rotated (not shown).

As shown in FIG. 12(A), the second processing member 20 is a ring, whilethe first processing member 10 is not a ring and can be a rotatingmember provided directly with a rotary shaft 50 similar to that of thefirst holder 11 in other embodiments. In this case, the upper surface ofthe first processing member 10 serves as the first processing surface 1,and the processing surface is an evenly flat surface which is notcircular (that is, hollow-free). In the apparatus shown in FIG. 12(A),similarly in the apparatus in FIG. 4(A), the second introduction part d2is arranged in the second ring 20, and its opening is arranged in thesecond processing surface 2.

As shown in FIG. 12(B), in the apparatus shown in FIG. 12(A), the secondholder 21 is independent of the case 3, and a surface-approachingpressure imparting mechanism 4 such as an elastic body for approachingto and separating from the first processing member 10 provided with thesecond ring 20 can be provided between the case 3 and the second holder21. In this case, as shown in FIG. 12(C), the second processing member20 is not a ring, but is a member corresponding to the second holder 21,and the lower surface of the member can serve as the second processingsurface 2. As shown in FIG. 13, in the apparatus shown in FIG. 12(C),the first processing member 10 is not a ring either, and in otherembodiments similarly in the apparatus shown in FIG. 12(A) and FIG.12(B), the site corresponding to the first holder 11 can serve as thefirst processing member 10, and its upper surface can serve as the firstprocessing surface 1.

In the embodiments described above, at least the first fluid is suppliedfrom the first processing member 10 and the second processing member 20,that is, from the central part of the first ring 10 and the second ring20, and after processing (mixing and reaction) of the other fluids, theprocessed fluid is discharged to the outside in the radial direction.

Alternatively, as shown in FIG. 13(B), the first fluid can be suppliedin the direction from the outside to the inside of the first ring 10 andsecond ring 20. In this case, the outside of the first holder 11 and thesecond holder 21 is sealed with the case 3, the first introduction partd1 is arranged directly in the case 3, and the opening of theintroduction part is arranged in a site inside the case andcorresponding to the abutting position of the rings 10 and 20, as shownin the figure. In the apparatus in FIG. 4(A), a discharge part 36 isarranged in the position in which the first introduction part d1 isarranged, that is, in the central position of the ring 1 of the firstholder 11. The opening of the second introduction part d2 is arranged inthe opposite side of the opening of the case behind the central shaft ofrotation of the holder. However, the opening of the second introductionpart d may be, similar to the opening of the first introduction part d1,arranged in a site inside the case and corresponding to the abuttingposition of the rings 10 and 20. As described above, the embodiment isnot limited to the one where the opening of the second introduction partd is formed to the opposite side of the opening of the firstintroduction part d1.

A discharge part 36 for the product after processing is arranged. Inthis case, the outside of the diameter of both rings 10 and 20 is on theupstream side, and the inside of both the rings 10 and 20 is on thedownstream side.

As shown in FIG. 13(C), in the apparatus shown in FIG. 13(B), the secondintroduction part d2, which is arranged in the side of the case 3, canbe arranged in the first ring 11 in space of the mentioned position, andits opening can be arranged in the first processing surface 1. In thiscase, as shown in FIG. 13(D), the first processing member 10 is notformed as a ring. Similarly in the apparatuses shown in FIG. 12(B), FIG.12(C) and FIG. 13(A), in other embodiments, the site corresponding tothe first holder 11 is the first processing member 10, its upper surfacebeing the first processing surface 1, the second introduction part d2being arranged in the first processing member 10, and its opening may bearranged in the first processing surface 1.

As shown in FIG. 14(A), in the apparatus shown in FIG. 13(D), the secondprocessing member 20 is not formed as a ring, and in other embodiments,the member corresponding to the second holder 21 serves as the secondprocessing member 2, and its lower surface serves as the secondprocessing surface 2. Then, the second processing member 20 is a memberindependent of the case 3, and the same surface-approaching pressureimparting mechanism 4 as one in the apparatuses shown in FIG. 12(C),FIG. 12(D) and FIG. 13(A) can be arranged between the case 3 and thesecond processing member 20.

As shown in FIG. 14(B), the second introduction part d2 in the apparatusshown in FIG. 14(A) serves as the third introduction part d3, andseparately the second introduction part d2 can be arranged. In thiscase, the opening of the second introduction part d2 is arrangedupstream from the opening of the third introduction part d3 in thesecond processing surface 2.

In the apparatuses shown in FIG. 7 and the apparatuses shown in FIG.8(A), FIG. 10(A), FIG. 10(B), FIG. 10(D), FIG. 11(B) and FIG. 11(C),other processed fluids flow into the first processed fluid beforereaching the processing surfaces 1 and 2, and these apparatuses are notsuitable for the fluid which is rapidly crystallized or separated.However, these apparatuses can be used for the fluid having a lowreaction speed.

The processing apparatus suitable for carrying out the method accordingto the present invention is summarized as follows.

As described above, the processing apparatus comprises a fluid pressureimparting mechanism that imparts predetermined pressure to a processedfluid, at least two processing members, that is, a first processingmember 10 arranged in a sealed fluid flow path through which a processedfluid at the predetermined pressure flows and a second processing member20 capable of approaching to and separating from the first processingmember 10, at least two processing surfaces of a first processingsurface 1 and a second processing surface 2 arranged in a position inwhich they are faced with each other in the processing members 10 and20, and a rotation drive mechanism that relatively rotates the firstprocessing member 10 and the second processing member 20, wherein atleast two processed fluids are mixed and reacted between the processingsurfaces 1 and 2. Of the first processing member 10 and the secondprocessing member 20, at least the second processing member 20 has apressure-receiving surface, at least a part of the pressure-receivingsurface is comprised of the second processing surface 2, and thepressure-receiving surface receives pressure applied by the fluidpressure imparting mechanism to at least one of the fluids to generate aforce to move in the direction of separating the second processingsurface 2 from the first processing surface 1. In this apparatus, theprocessed fluid that has received said pressure passes through the spacebetween the first processing surface 1 and the second processing surface2 capable of approaching to and separating from each other, therebygenerating a desired reaction between the processed fluids with theprocessed fluids being passed between the processing surfaces 1 and 2and forming a fluid film of predetermined thickness.

In this processing apparatus, at least one of the first processingsurface 1 and the second processing surface 2 is preferably providedwith a buffer mechanism for regulation of micro-vibration and alignment.

In this processing apparatus, one of or both the first processingsurface 1 and the second processing surface 2 is preferably providedwith a displacement regulating mechanism capable of regulating thedisplacement in the axial direction caused by abrasion or the likethereby maintaining the thickness of a fluid film between the processingsurfaces 1 and 2.

In this processing apparatus, a pressure device such as a compressor forapplying predetermined feeding pressure to a fluid can be used as thefluid pressure imparting mechanism.

As the pressure device, a device capable of regulating an increase anddecrease in feeding pressure is used. This is because the pressuredevice should be able to keep established pressure constant and shouldbe able to regulate an increase and decrease in feeding pressure as aparameter to regulate the distance between the processing surfaces.

The processing apparatus can be provided with a separation preventingpart for defining the maximum distance between the first processingsurface 1 and the second processing surface 2 and preventing theprocessing surfaces 1 and 2 from separating from each other by themaximum distance or more.

The processing apparatus can be provided with an approach preventingpart for defining the minimum distance between the first processingsurface 1 and the second processing surface and preventing theprocessing surfaces 1 and 2 from approaching to each other by theminimum distance or less.

The processing apparatus can be one wherein both the first processingsurface 1 and the second processing surface 2 are rotated in oppositedirections.

The processing apparatus can be provided with a temperature-regulatingjacket for regulating the temperature of either or both of the firstprocessing surface 1 and the second processing surface 2.

The processing apparatus is preferably one wherein at least a part ofeither or both of the first processing surface 1 and the secondprocessing surface 2 is mirror-polished.

The processing apparatus can be one wherein one of or both the firstprocessing surface 1 and the second processing surface 2 is providedwith depressions.

The processing apparatus preferably includes, as a means for feeding oneprocessed fluid to be reacted with another processed fluid, a separateintroduction path independent of a path for another processed fluid, atleast one of the first processing surface and the second processingsurface is provided with an opening leading to the separate introductionpath, and another processed fluid sent through the separate introductionpath is introduced into the processed fluid.

The processing apparatus for carrying out the present inventioncomprises a fluid pressure imparting mechanism that impartspredetermined pressure to a fluid, at least two processing surfaces of afirst processing surface 1 and a second processing surface 2 capable ofapproaching to and separating from each other which are connected to asealed fluid flow path through which the processed fluid at thepredetermined pressure is passed, a surface-approaching pressureimparting mechanism that imparts surface-approaching pressure to thespace between the processing surfaces 1 and 2, and a rotation drivemechanism that relatively rotates the first processing surface 1 and thesecond processing surface 2, whereby at least two processed fluids arereacted between the processing surfaces 1 and 2, at least one processedfluid pressurized with the fluid pressure imparting mechanism is passedthrough the space between the first processing surface 1 and the secondprocessing surface 2 rotating to each other and supplied withsurface-approaching pressure, and another processed fluid is passed, sothat the processed fluid pressurized with the fluid pressure impartingmechanism, while being passed between the processing surfaces andforming a fluid film of predetermined thickness, is mixed with anotherprocessed fluid, whereby a desired reaction is caused between theprocessed fluids.

The surface-approaching pressure imparting mechanism can constitute abuffer mechanism of regulating micro-vibration and alignment and adisplacement regulation mechanism in the apparatus described above.

The processing apparatus for carrying out the present inventioncomprises a first introduction part that introduces, into the apparatus,at least one of two processed fluids to be reacted, a fluid pressureimparting mechanism p that is connected to the first introduction partand imparts pressure to the processed fluid, a second introduction partthat introduces at least the other fluid of the two processed fluids tobe reacted, at least two processing members, that is, a first processingmember 10 arranged in a sealed fluid flow path through which the otherprocessed fluid is passed and a second processing member 20 capable ofrelatively approaching to and separating from the first processingmember 10, at least two processing surfaces, that is, a first processingsurface 1 and a second processing surface 2 arranged so as to beopposite to each other in the processing members 10 and 20, a holder 21that accepts the second processing member 20 so as to expose the secondprocessing surface 2, a rotation drive mechanism that relatively rotatesthe first processing member 10 and the second processing member 20, anda surface-approaching pressure imparting mechanism 4 that presses thesecond processing member 20 against the first processing surface 1 suchthat the second processing surface 2 is contacted against or made closeto the first processing surface 1, wherein the processed fluids arereacted between the processing surfaces 1 and 2, the holder 21 isprovided with an opening of the first introduction part and is notmovable so as to influence the space between the processing surfaces 1and 2, at least one of the first processing member 10 and the secondintroduction part 20 is provided with an opening of the secondintroduction part, the second processing member 20 is circular, thesecond processing surface 2 slides along the holder 21 and approaches toand separates from the first processing surface 1, the second processingmember 20 includes a pressure-receiving surface, the pressure-receivingsurface receives pressure applied by the fluid pressure impartingmechanism p to the processed fluid to generate a force to move in thedirection of separating the second processing surface 2 from the firstprocessing surface 1, at least a part of the pressure-receiving surfaceis comprised of the second processing surface 2, one of the processedfluids to which pressure was applied is passed through the space betweenthe first processing surface 1 and the second processing surface 2rotating to each other and capable of approaching to and separating fromeach other, and the other processed fluid is supplied to the spacebetween the processing surfaces 1 and 2, whereby both the processedfluids form a fluid film of predetermined thickness and pass through thespace between both the processing surfaces 1 and 2, the passingprocessed fluid are mixed thereby promoting a desired reaction betweenthe processed fluids, and the minimum distance for generating the fluidfilm of predetermined thickness is kept between the processing surfaces1 and 2 by the balance between the surface-approaching pressure by thesurface-approaching pressure imparting mechanism 4 and the force ofseparating the processing surfaces 1 and 2 from each other by the fluidpressure imparted by the fluid pressure imparting mechanism p.

In this processing apparatus, the second introduction part can be,similarly being connected to the first introduction part, arranged to beconnected to a separate fluid pressure imparting mechanism and to bepressurized. The processed fluid introduced from the second introductionpart is not pressurized by the separate fluid pressure impartingmechanism, but is sucked and supplied into the space between theprocessing surfaces 1 and 2 by negative pressure generated in the secondintroduction part by the fluid pressure of the processed fluidintroduced into the first introduction part. Alternatively, the otherprocessed fluid flows downward by its weight in the second introductionpart and can be supplied into the space between the processing surfaces1 and 2.

As described above, the apparatus is not limited to the one wherein theopening of the first introduction part as an inlet for feeding the otherprocessed fluid into the apparatus is arranged in the second holder, andthe opening of the first introduction part may be arranged in the firstholder. The opening of the first introduction part may be formed with atleast one of the processing surfaces. However, when the processed fluidto be previously introduced into the space between the processingsurfaces 1 and 2 should, depending on the reaction, be supplied from thefirst introduction part, the opening of the second introduction part asan inlet for feeding the other processed fluid into the apparatus shouldbe arranged downstream from the opening of the first introduction partin any of the processing surfaces.

As the processing apparatus for carrying out the present invention, thefollowing apparatus can be used.

This processing apparatus comprises a plurality of introduction partsthat separately introduce two or more processed fluids to be reacted, afluid pressure imparting mechanism p that imparts pressure to at leastone of the two or more processed fluids, at least two processingmembers, that is, a first processing member 10 arranged in a sealedfluid flow path through which the processed fluid is passed and a secondprocessing member 20 capable of approaching to and separating from thefirst processing member 10, at least two processing surfaces 1 and 2,that is, a first processing surface 1 and a second processing surface 2arranged in a position in which they are faced with each other in theprocessing members 10 and 20, and a rotation drive mechanism thatrelatively rotates the first processing member 10 and the secondprocessing member 20, wherein the processed fluids are reacted betweenthe processing surfaces 1 and 2, at least the second processing member20 of the first processing member 10 and the second processing member 20includes a pressure-receiving surface, at least a part of thepressure-receiving surface is comprised of the second processing surface2, the pressure-receiving surface receives pressure applied by the fluidpressure imparting mechanism to the processed fluid to generate a forceto move in the direction of separating the second processing surface 2from the first processing surface 1, the second processing member 20includes an approach regulating surface 24 that is directed to theopposite side of the second processing surface 2, the approachregulating surface 24 receives predetermined pressure applied to theprocessed fluid to generate a force to move in the direction ofapproaching the second processing surface 2 to the first processingsurface 1, a force to move in the direction of separating the secondprocessing surface 2 from the first processing surface 1 as a resultantforce of total pressure received from the processed fluid is determinedby the area ratio of the projected area of the approach regulatingsurface 24 in the approaching and separating direction to the projectedarea of the pressure-receiving surface in the approaching and separatingdirection, the processed fluid to which pressure was applied is passedthrough the space between the first processing surface 1 and the secondprocessing surface 2 that rotate relative to each other and capable ofapproaching to and separating from each other, the other processed fluidto be reacted with the processed fluid is mixed in the space between theprocessing surfaces, and the mixed processed fluid forms a fluid film ofpredetermined thickness and simultaneously passes through the spacebetween the processing surfaces 1 and 2, thereby giving a desiredreaction product while passing through the space between the processingsurfaces.

In the apparatus according to the present invention, the followingprocessing method can be carried out. The processing method comprisesapplying predetermined pressure to a first processing fluid, connectingat least two processing surfaces of a first processing surface 1 and asecond processing surface 2, which are capable of approaching to andseparating from each other, to a sealed fluid flow path in which aprocessed fluid under this predetermined pressure is flowed, applyingcontacting pressure for allowing the processing surfaces 1 and 2 tocontact with each other, rotating the first processing surface 1 and thesecond processing surface 2 relatively and introducing the processedfluid into the processing surfaces 1 and 2, introducing a secondprocessed fluid reacting with the processed fluid into the processingsurfaces 1 and 2 through another fluid path to react both the processedfluids, allowing the predetermined pressure applied to at least thefirst processed fluid to act as a separation force of separating boththe processed surfaces 1 and 2 from each other, balancing the separationforce and the contacting pressure via the processed fluid between theprocessing surfaces 1 and 2 so that both the processing surfaces 1 and 2are maintained to be in a predetermined minute distance, allowing theprocessed fluid to pass through the processed fluids 1 and 2 as a fluidfilm in a predetermined thickness, and uniformly conducting the reactionof both the processing fluids during this passage, and crystallizing orseparating the desired reaction product in the case of the reactionaccompanied by separation.

Then, the process capable of carrying out using the fluid processingapparatus according the present invention will be described below. Thefluid processing apparatus according to the present invention is notlimited to the following examples, and may be used not only forreactions in conventional micro-reactors and micro-mixers but also forprocesses such as other various reactions, mixing and dispersing.

A reaction wherein at least one pigment is dissolved in a strong acidsuch as sulfuric acid, nitric acid or hydrochloric acid to prepare apigment acidic solution, which is then mixed with a solution containingwater, to prepare pigment particles (acid pasting method).

A reaction wherein at least one pigment is dissolved in an organicsolvent to prepare a pigment solution, and then the pigment solution ischarged into a solvent which is a poor solvent for the pigment and whichis a poor solvent compatible with the organic solvent used inpreparation of the solution to precipitate pigment particles(re-precipitation method).

A reaction wherein either of an acidic or alkaline pH adjusting solutionor a mixed solution of the pH adjusting solution and an organic solventis mixed with a pigment solution in which at least one pigment isdissolved and with a pigment-separating solution that changes the pH ofthe pigment solution which does not show solubility for the pigmentcontained in the pigment solution or shows less solubility for thepigment contained in the pigment solvent than in the solvent containedin the pigment solution, to obtain pigment particles.

A reaction of supporting metal microparticles on the surface of carbonblack by a liquid-phase reduction method (the metal can be exemplifiedby at least one metal selected from the group consisting of platinum,palladium, gold, silver, rhodium, iridium, ruthenium, osmium, cobalt,manganese, nickel, iron, chromium, molybdenum, and titanium).

A reaction of producing crystals comprised of fullerene molecules andfullerene nanowhiskers/nanofiber nanotubes, by mixing a solutioncontaining a first solvent in which fullerene is dissolved with a secondsolvent having a lower solubility for fullerene than the first solvent.

A reaction of reducing a metal compound (the metal can be exemplified bya noble metal such as gold, silver, ruthenium, rhodium, palladium,osmium, iridium or platinum, or copper, or an alloy of two or moremetals described above).

A reaction of hydrolyzing a ceramic material (the ceramic material canbe exemplified by at least one kind selected from Al, Ba, Mg, Ca, La,Fe, Si, Ti, Zr, Pb, Sn, Zn, Cd, As, Ga, Sr, Bi, Ta, Se, Te, Hf, Mg, Ni,Mn, Co, S, Ge, Li, B, and Ce).

A reaction of separating titanium dioxide superfine particles byhydrolyzing a titanium compound (the titanium compound can beexemplified by at least one kind selected from tetraalkoxy titanium suchas tetramethoxy titanium, tetraethoxy titanium, tetra-n-propoxytitanium, tetraisopropoxy titanium, tetra-n-butoxy titanium,tetraisobutoxy titanium, tetra-t-butoxy titanium and derivativesthereof, and titanium tetrachloride, titanyl sulfate, titanium citrateand titanium tetranitrate).

A reaction of forming compound semiconductor microparticles throughco-precipitation/separation by joining fluids that are semiconductormaterials and contain ions having different elements (the compoundsemiconductor can be exemplified by group II-VI compound semiconductors,group III-V compound semiconductors, group IV compound semiconductorsand group I-III-VI compound semiconductors).

A reaction of forming semiconductor microparticles by reducing asemiconductor element (the semiconductor element can be exemplified byan element selected from the group consisting of silicon (Si), germanium(Ge), carbon (C), and tin (Sn)).

A reaction of forming magnetic microparticles by reducing a magneticmaterial (the magnetic material can be exemplified by at least one kindselected from nickel, cobalt, iridium, iron, platinum, gold, silver,manganese, chromium, palladium, yttrium, and lanthanides (neodymium,samarium, gadolinium and terbium)).

A reaction wherein a fluid having at least one biologically ingestiblemicroparticle raw material dissolved in a first solvent is mixed with asolvent capable of serving as a second solvent having a lower solubilitythan the first solvent, to separate biologically ingestiblemicroparticles.

Alternatively, a reaction wherein a fluid containing at least one acidicsubstance or cationic substance is mixed with a fluid containing atleast one basic substance or anionic substance, and biologicallyingestible microparticles are separated by neutralization reaction.

A process wherein a fluid to be processed including an oil phasecomponent containing lipid-soluble pharmacologically active substance ismixed with a fluid to be processed comprised of at least a liquiddispersing solvent, or a fluid to be processed including a water phasecomponent containing a water-soluble pharmacologically active substanceis mixed with a fluid to be processed comprised of at least an oil-baseddispersing solvent, to obtain microemulsion particles.

Alternatively, a process wherein one or more kinds of phospholipid iscontained in at least either a dispersed phase or a continuous phase,wherein the dispersed phase contains a pharmacologically activesubstance, while the continuous phase is comprised of a liquiddispersing solvent, and the fluid of the dispersed phase and the fluidof the continuous phase are mixed to obtain liposomes.

A process wherein a fluid having a resin dissolved in a solvent having asolubility and compatibility for resins is mixed with an aqueous solventto obtain resin microparticles by separation or emulsification.

Alternatively, a process wherein a heated and molten resin is mixed withan aqueous solvent to obtain fine resin particles byemulsification/dispersion.

Reactions of obtaining microparticles by organic reaction of an organiccompound as a starting material with various organic reacting agents,such as Friedel-Crafts reaction, nitration reaction, addition reaction,elimination reaction, transfer reaction, polymerization reaction,condensation reaction, coupling reaction, acylation, carbonylation,aldehyde synthesis, peptide synthesis, aldol reaction, indole reaction,electrophilic substitution reaction, nucleophilic substitution reaction,Wittig reaction, Michael addition reaction, enamine synthesis, estersynthesis, enzyme reaction, diazo coupling reaction, oxidation reaction,reduction reaction, multistep reaction, selective addition reaction,Suzuki-Miyaura coupling reaction, Kumada-Corriu reaction, metathesisreaction, isomerization, radical polymerization reaction, anionicpolymerization reaction, cationic polymerization reaction, metalliccatalytic polymerization reaction, consecutive reaction, macromoleculesynthesis, acetylene coupling reaction, episulfide synthesis, episulfidesynthesis, Bamberger rearrangement, Chapman rearrangement, Claisencondensation, quinoline synthesis, Paal-Knorr furan synthesis,Paal-Knorr pyrrole synthesis, Passerini reaction, Paterno-Buchireaction, carbonyl-ene reaction (Prins reaction), Jacobsenrearrangement, Koenigs-Knorr glycosidation reaction, Leuckart-Wallachreaction, Horner-Wadsworth-Emmons reaction, Gassman reaction, Noyoriasymmetric hydrogenation reaction, Perkin reaction, Petasis reaction,Tishchenko reaction, Tishchenko reaction, Ullmann coupling, Nazarovcyclization, Tiffeneau-Demjanov rearrangement, template synthesis,oxidation with selenium dioxide, Reimer-Tiemann reaction, Grobfragmentation, haloform reaction, Malaprade glycol oxidation cleavage,Hofmann elimination, thiocarbonylation by Lawesson's reagent, Lossenrearrangement, cyclic ketone synthesis using FAMSO, Favorskiirearrangement, Feist-Benary furan synthesis, Gabriel amine synthesis,Glaser reaction, Grignard reaction, Cope elimination, Coperearrangement, diimide reduction of alkynes, Eschenmoseraminomethylation reaction, [2+2] photocyclization, Appel reaction,aza-Wittig reaction, Bartoli indole synthesis, Carroll rearrangement,Chichibabin reaction, Clemmensen reduction, Combes quinoline synthesis,Tsuji-Trost reaction, TEMPO oxidation, dihydroxylatioin with osmiumtetroxide, Fries rearrangement, Neber rearrangement, Barton-McCombiedeoxygenation, Barton decarboxylation, Seyferth-Gilbert alkynesynthesis, Pinnick (Kraus) oxidation, Ito-Saegusa oxidation, Eschenmoserfragmentation, Eschenmoser-Claisen rearrangement, Doering-LaFlammeallene synthesis, Corey-Chaykovsky reaction, acyloin condensation,Wolff-Kishner reduction, IBX oxidation, Parikh-Doering oxidation,Reissert reaction, Jacobsen hydrolytic kinetic optical resolution,benzilic acid rearrangement, Hiyama cross coupling, Luche reduction,oxymercuration, Vilsmeier-Haak reaction, Wolff rearrangement,Kolbe-Schmitt reaction, Corey-Kim oxidation, Cannizzaro reaction, Henryreaction, transformation of alcohol into alkane, Arndt-Eistertsynthesis, hydroformylation, Peterson olefination, decarbonylation,Curtius rearrangement, Wohl-Zieglar bromination, Pfitzner-Moffattoxidation, McMurry coupling, Barton reaction, Balz-Schiemann reaction,Masamune-Bergman reaction, Dieckmann condensation, pinacol coupling,Williamson ether synthesis, iodolactonization, Harries ozonolysis,oxidation with active manganese dioxide, alkyne cyclotrimerization,Kumada-Tamao-Corriu cross coupling, sulfoxide and selenoxide syn-βelimination, Fischer indole synthesis, Oppenauer oxidation, Darzenscondensation, Alder Ene reaction, Sarett-Collins oxidation,Nozaki-Hiyama-Kishi coupling reaction, Weinreb ketone synthesis, DASTfluorination, Corey-Winter olefin synthesis, Hosomi-Sakurai reaction,alcohol oxidation using PCC (PDC), Jones oxidation (Jones Oxidation),Keck allylation, cyanide addition using Nagata reagent, Negishicoupling, Ireland-Claisen rearrangement, Baeyer-Villiger oxidation,p-methoxybenzyl (PMB or MPM), dimethoxybenzyl (DMB) protection,deprotection, Wacker oxidation, Myers asymmetric alkylation, Yamaguchimacrolactonization, Mukaiyama-Corey macrolactonization, Bode peptidesynthesis, Lindlar reduction, homogeneous hydrogenation, orthometalation, Wagnar-Meerwein rearrangement, Wurtz reaction, ketonesynthesis using 1,3-dithiane, Michael addition, Stork enamine synthesisof ketone, Pauson-Khand cyclopentene synthesis, and Tebbe reaction.

1. A fluid processing apparatus for processing a material to beprocessed between processing surfaces in processing members capable ofapproaching to and separating from each other, at least one of whichrotates relative to the other, using a first fluid containing a materialto be processed being introduced between the processing surfaces by amicropump effect in a depression arranged on at least one of theprocessing surfaces from inside to outside of the radial direction ofthe rotating processing surfaces, and a second fluid containing amaterial to be processed being introduced between the processingsurfaces from another flow path that is independent of the flow path forintroducing the first fluid and is provided with an opening leading tothe processing surfaces, whereby the processing is done by mixing andstirring between the processing surfaces, wherein, in a plane along theprocessing surfaces, directionality accompanies the introducingdirection from the opening of the second fluid into the processingsurfaces, and, regarding the introducing direction of the second fluid,it is an outward direction away from the center for the fluid in theradial direction of the processing surface, and it is a forwarddirection for the fluid in the rotation direction of the fluid betweenthe rotating processing surfaces.
 2. The fluid processing apparatusaccording to claim 1, wherein the introducing direction from the openingof the second fluid into the processing surfaces is inclined relative tothe processing surfaces.
 3. The fluid processing apparatus according toclaim 1, wherein the bore diameter of the opening or the diameter of theflow path is 0.2 μm to 3000 μm.
 4. The fluid processing apparatusaccording to claim 1, wherein the micropump effect produces an effectsuch that a force is generated in the direction of separating theprocessing surfaces from each other by rotating the processing surfacesprovided with a depression, and further a fluid is introduced into theprocessing surfaces.
 5. The fluid processing apparatus according toclaim 1, wherein the depression arranged on the processing surfaces hasa depth of 1 μm to 50 μm.
 6. The fluid processing apparatus according toclaim 1, wherein a total plane area of the depressions arranged on theprocessing surfaces is 5% to 50% of the total plane area of theprocessing surfaces provided with the depressions.
 7. The fluidprocessing apparatus according to claim 1, wherein the number of thedepressions arranged on the processing surfaces is 3 to
 50. 8. The fluidprocessing apparatus according to claim 1, wherein the depressionarranged on the processing surfaces is at least one kind selected from adepression extending in a curved form, a depression extending in aspiral form, a depression extending in bending at a right angle and adepression having depth changing continuously, in its plane form.
 9. Thefluid processing apparatus according to claim 1, wherein the opening inthe separate flow path is arranged at a position nearer to the outerdiameter than a position where the direction of a flow upon introductionby the micropump effect from the depression arranged on the processingsurfaces is converted into the direction of a spiral laminar flow formedbetween the processing surfaces.
 10. The fluid processing apparatusaccording to claim 1, wherein the opening in the separate flow path isarranged in a place apart 0.5 mm or more from the outermost side in theradial direction of the processing surface of the depression arranged onthe processing surfaces to the outside in the radial direction.
 11. Thefluid processing apparatus according to claim 1, wherein a plurality ofthe openings are arranged for the same kinds of fluids, and theplurality of the openings for the same kinds of fluids areconcentrically arranged.
 12. The fluid processing apparatus according toclaim 1, wherein a plurality of the openings are arranged for thedifferent kinds of fluids, and the plurality of the openings for thedifferent kinds of fluids are concentrically arranged.
 13. The fluidprocessing apparatus according to claim 1, wherein the processingmembers are dipped in a fluid, and a fluid obtained by processingbetween the processing surfaces is directly fed into a liquid outsidethe processing members or into a gas other than air.
 14. The fluidprocessing apparatus according to claim 1, wherein ultrasonic energy canbe applied to the processed material just after being discharged fromthe space between the processing surfaces or from the processingsurfaces.
 15. A method of processing a fluid using the fluid processingapparatus of claim 1, wherein a first fluid containing a material to beprocessed is introduced between processing surfaces by a micropumpeffect in a depression arranged on at least one of the processingsurfaces from inside to outside of the radial direction of the rotatingprocessing surfaces, and a second fluid containing a material to beprocessed is introduced between the processing surfaces from anotherflow path that is independent of the flow path for introducing the firstfluid and is provided with an opening leading to the processingsurfaces, whereby these fluids are reacted with each other by mixing andstirring between the processing surfaces.
 16. A fluid processingapparatus using at least two kinds of fluids, at least one kind of thefluids containing at least a kind of material to be processed, thefluids joining together between processing surfaces capable ofapproaching to and separating from each other, at least one of whichrotating relative to the other to form a thin film fluid, the materialbeing processed in the thin film fluid, wherein a fluid between theprocessing surfaces is processed by giving a temperature gradient. 17.The fluid processing apparatus according to claim 16, wherein of theprocessing surfaces, the temperature of one of the processing surfacesis made higher than that of the other processing surface, thereby givinga temperature gradient in the fluid between the processing surfaces. 18.The fluid processing apparatus according to claim 17, wherein thetemperature difference between one of the processing surfaces and theother processing surface is 1° C. to 400° C.
 19. The fluid processingapparatus according to claim 16, wherein the processing surfaces inprocessing members are arranged to be opposite to each other so as to beable to approach to and separate from each other, at least one of whichrotates relative to the other, and the processing members are providedwith a temperature regulating mechanism for cooling and heating theprocessing surfaces.
 20. The fluid processing apparatus according toclaim 19, wherein the temperature regulating mechanism is at least onemember selected from a pipe for passing a temperature regulating medium,a cooling element, and a heating element.
 21. The fluid processingapparatus according to claim 16, wherein a flow of the fluid between theprocessing surfaces is generated by the temperature gradient, and adirectional factor of this flow contains at least a directional factorperpendicular to the processing surfaces.
 22. The fluid processingapparatus according to claim 16, wherein Benard convection or Marangoniconvection is generated in the fluid between the processing surfaces bythe temperature gradient.
 23. The fluid processing apparatus accordingto claim 16, wherein the temperature difference ΔT between theprocessing surfaces and the distance L between the processing surfacessatisfy the following condition: Rayleigh number Ra defined by thefollowing equation is 1700 or more:Ra=L ³ ·g·β·ΔT/(α·ν) wherein g is gravitational acceleration; β iscoefficient of volumetric thermal expansion of fluid; ν is dynamicviscosity of fluid; and α is heat diffusivity of fluid.
 24. The fluidprocessing apparatus according to claim 16, wherein the temperaturedifference ΔT between the processing surfaces and the distance L betweenthe processing surfaces satisfy the following condition: Marangoninumber defined by the following equation is 80 or more:Ma=σ·ΔT·L/(ρ·ν·α) wherein ν is dynamic viscosity of fluid; α is heatdiffusivity of fluid; ρ is density of fluid; and σ is temperaturecoefficient of surface tension (temperature gradient of surfacetension).
 25. A method of processing a fluid using in the fluidprocessing apparatus of claim 16, wherein at least two kinds of fluidsare reacted with each other by mixing and stirring between theprocessing surfaces.
 26. A fluid processing apparatus using at least twokinds of fluids, at least one kind of the fluids containing at least akind of material to be processed, the fluids joining together betweenprocessing surfaces capable of approaching to and separating from eachother, at least one of which rotating relative to the other to form athin film fluid, the material being processed in the thin film fluid,wherein the processing members are comprised of: a depression forintroducing a material to be processed between the processing surfacesprovided on at least one of the processing surfaces; an inclined surfaceprovided on a processing member opposite to the processing memberprovided with the depression, the inclined surface being formed suchthat, based on the flowing direction of the processed fluid, thedistance in the axial direction between the upstream end of the inclinedsurface and the processing surface of the opposite processing member ismade larger than the distance between the downstream end of the inclinedsurface and the processing surface of the processing member, thedownstream end of the inclined surface being arranged on the projectedarea in the axial direction of the depression.
 27. The fluid processingapparatus according to claim 26, wherein, in the processing memberprovided with the inclined surface, the angle of the inclined surface tothe processing surface is in the range of 0.1° to 85°.